Novel 5G antenna circuit board pressing manufacturing method

Abstract

The invention discloses a novel 5G antenna circuit board pressing manufacturing method, and belongs to the technical field of circuit boards. The main points of the technical scheme are that the method comprises the following steps: cutting: cutting an upper substrate, a lower substrate and a prepreg according to a set shape and size; arranging a bonding pad: arranging an upper bonding pad and a lower bonding pad on the upper substrate and the lower substrate respectively; trepanning: arranging a first through hole in the upper substrate, and arranging a second through hole in the prepreg; deburring: placing the upper substrate on a polishing and brushing machine, and polishing and brushing the edge of the hole of the upper substrate; cleaning: cleaning the upper substrate by means of an alkaline solution; carrying out film pasting: pasting a glue blocking layer on the lower bonding pad; and folding the plate: placing the prepreg between the upper substrate and the lower substrate, and then stacking the prepreg, the upper substrate and the lower substrate together. According to the novel 5G antenna circuit board and the pressing manufacturing method thereof, the situation of glue overflow does not occur in the pressing process, and friction and position offset between the substrates are not easy to generate so that the reject ratio of finished products is effectively reduced.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a press-fit manufacturing method for a novel 5G antenna circuit board. Background technique [0002] The names of the circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin Thin circuit boards, printed (copper etching technology) circuit boards, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. [0003] 5G is the latest generation of cellular mobile communication technology and an extension of 4G (LTE-A, WiMax), 3G (UMTS, LTE) and 2G (GSM) systems. The performance goals of 5G are high data rates, reduced latency, energy savings, cost r...

AI Technical Summary

Problems solved by technology

[0004] The 5G antenna circuit board is mainly manufactured by lamination of multiple substrates. Most of the traditional lamination manufacturing processes are lamination first and then punching, so it is easy to have glue overflow during the lamination process, and the lamination If the holes are drilled later, friction and positional deviation between the substrates are prone to occur, which not only easily damages the substrate, but also greatly increases the defect rate of the finished product

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