Negative pressure adsorption type hardware surface polishing machining equipment

A technology for surface polishing and processing equipment, applied in metal processing equipment, surface polishing machine tools, grinding/polishing equipment, etc., can solve the problems of slow burr discharge speed and burr adsorption force, and reduce the bearing capacity. , the effect of speeding up the discharge speed and speeding up the swing speed

Inactive Publication Date: 2021-06-04
许志彬
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Use a polishing machine to polish the surface of the hardware product. Put the hardware product against the outer wall of the polishing plate on the polishing table. The motor drives the polishing plate to rotate at a high speed and rub against the outer wall of the hardware product to remove the burrs on the outer wall of the hardware product. At the same time, the polishing table is equipped with air negative pressure. Machine, the negative air pressure generated by the air negative pressure machine will absorb the burrs into the accumulation cavity of the polishing table, and the airflow generated by the fan will blow and discharge the burrs to the chip discharge pipe; in the prior art, when the polishing machine is used to polish the surface of hardware products, Since the top of the air negative pressure machine is equipped with an air flow port, when the fan stops working, the burrs will fall down due to the vibration force of the polishing table and easily enter into the air flow port of the negative pressure machine. As the burrs gradually increase, the air negative pressure machine will Less suction on burrs and slower discharge of burrs from polishing on the top of the polishing table

Method used

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  • Negative pressure adsorption type hardware surface polishing machining equipment
  • Negative pressure adsorption type hardware surface polishing machining equipment
  • Negative pressure adsorption type hardware surface polishing machining equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] as attached figure 1 to attach Figure 5 Shown:

[0026] The invention provides a negative pressure adsorption surface polishing processing equipment for hardware products, the structure of which includes a polishing table 1, a control panel 2, and a polisher 3, the control panel 2 is arranged on the front of the polishing table On the left top of polishing table 1.

[0027] The polishing table 1 is provided with a stacking chamber 11, a negative pressure machine 12, a chip removal pipe 13, an air flow port 14, and a fan 15. Below the accumulation chamber 11, the chip removal pipe 13 runs through the inner and outer walls of the right side of the accumulation chamber 11 horizontally, the air flow port 14 is arranged on the top of the negative pressure machine 12, and the fan 15 is fixed on the left inner wall of the accumulation chamber 11.

[0028] Wherein, the airflow port 14 is provided with a support rod a1, an engaging shaft a2, a reset bar a3, a clamping block ...

Embodiment 2

[0034] as attached Figure 6 to attach Figure 7 Shown:

[0035]Wherein, the support rod a1 is provided with a card slot r1, a moving plate r2, and a telescopic rod r3, the card slot r1 is recessed on the upper surface of the support rod a1, the moving plate r2 is set inside the card slot r1, and the telescopic rod r3 is installed between the bottom surface of the moving plate r2 and the inner bottom of the card slot r1, and the moving plate r2 respectively cooperates with two identical telescopic rods r3, which can increase the driving force of the telescopic rod r3 on the moving plate r2 and speed up the moving plate The speed at which r2 moves upwards speeds up the moving plate r2 to push up the burrs on the top of the support rod a1, reducing the accumulation of burrs on the top of the support rod a1.

[0036] Wherein, the moving plate r2 is provided with an inner groove t1, a bouncing ball t2, a bouncing block t3, and a pushing block t4, the inner groove t1 is set insid...

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Abstract

The invention discloses negative pressure adsorption type hardware surface polishing machining equipment. The negative pressure adsorption type hardware surface polishing machining equipment structurally comprises a polishing table, a control panel and a polisher, the control panel is arranged on the front face of the polishing table, the polisher is installed at the top of the left side of the polishing table, and the polishing table is provided with a stacking cavity, a negative pressure machine, a chip removal pipe, an airflow opening and a fan. Due to the fact that burrs fall down due to vibration force of the polishing table and easily enter the airflow opening of the negative pressure machine, a clamping block is arranged in an airflow opening of the negative pressure machine to block the burrs, the burrs entering the airflow opening can be reduced, the adsorption force of the air negative pressure machine to the burrs can be increased, and the discharging speed of the burrs generated by polishing of the top of the polishing table is increased; due to the fact that burrs are retained at the top of a supporting rod, the gravity of the supporting rod is increased, the supporting rod is provided with a moving plate, the moving plate moves up and down to push the burrs retained at the top of the supporting rod upwards, the bearing capacity of the supporting rod can be reduced, and the swing speed of the supporting rod is increased.

Description

technical field [0001] The invention belongs to the field of surface polishing processing in hardware production, and more specifically relates to a negative pressure adsorption surface polishing processing equipment for hardware products. Background technique [0002] Use a polishing machine to polish the surface of the hardware product. Put the hardware product against the outer wall of the polishing plate on the polishing table. The motor drives the polishing plate to rotate at a high speed and rub against the outer wall of the hardware product to remove the burrs on the outer wall of the hardware product. At the same time, the polishing table is equipped with air negative pressure. Machine, the negative air pressure generated by the air negative pressure machine will absorb the burrs into the accumulation cavity of the polishing table, and the airflow generated by the fan will blow and discharge the burrs to the chip discharge pipe; in the prior art, when the polishing ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02B24B9/04B24B55/12B24B55/00
CPCB24B9/04B24B29/02B24B55/00B24B55/12
Inventor 许志彬
Owner 许志彬
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