Calibration method and device for on-chip temperature parameters of high and low temperature probe station

Abstract

The invention provides a calibration method and device for on-chip temperature parameters of a high and low temperature probe station, and belongs to the technical field of semiconductor measurement, and the calibration method comprises the steps: placing an on-chip temperature sensor on a temperature control platform of the high and low temperature probe station, and pushing the temperature control platform into a micro-chamber of the high and low temperature probe station; observing through a microscope of the high and low temperature probe station, and adjusting the position of the direct current probe so as to enable the direct current probe to be in contact with a welding pad of the on-chip temperature sensor; connecting the direct current probe with an electric measuring instrument; setting a standard temperature, and calibrating a temperature parameter of the high and low temperature probe station; and carrying out uncertainty evaluation on the calibrated measurement result. The calibration method has the technical effects that the working condition during actual measurement can be well simulated, the calibration precision is more easily improved, and after the temperature parameter calibration is completed, uncertainty evaluation is performed on the measurement result, so that the accuracy of the measurement result can be judged, and an effective calibration effect is realized.

Description

technical field [0001] The invention belongs to the technical field of semiconductor measurement, and more specifically relates to a calibration method and device for on-chip temperature parameters of a high and low temperature probe station. Background technique [0002] With the continuous development of science and technology, semiconductor devices are getting more and more attention in the field of industrial production, and the integration level is getting higher and higher. Since the cost of chip packaging accounts for a large In chip testing, if defective products in the wafer are found to be marked, these marked defective products can be discarded before subsequent packaging, saving unnecessary packaging costs. Therefore, how to effectively detect bare chips is of great importance to the semiconductor industry. is crucial. [0003] For this reason, a high and low temperature probe station has appeared, which can measure the performance parameters of semiconductor de...

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Problems solved by technology

[0014] The purpose of the present invention is to provide a method and device for calibrating the on-chip temperature parameters of a high and low temperature probe station, aiming to solve the problem that the traditional calibration process cannot simulate the working conditions of the actual measurement, and it is difficult to accurately calibrate the temperature parameters of the high and low temperature probe station technical issues for the purpose of

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