Computer heat dissipation structure and processing method thereof

Abstract

The invention discloses a computer heat dissipation structure and a processing method thereof.The computer heat dissipation structure comprises an independent fan, a fin cleaning device and a supporting air pipe, the independent fan is a bladeless fan, and the fin cleaning device comprises an annular shell, a pulse gas generating assembly, a gas spraying assembly, a track outer ring part and a track inner ring part; an annular through track is formed between the track outer ring part and the track inner ring part in the track outer ring part, an annular air inlet cavity is formed in the annular shell and connected with the pulse gas generation assembly, a pulse gas output port of the pulse gas generation assembly is fixed and communicated with the gas injection assembly, and a gas injection port of the gas injection assembly extends to the side face of the heat dissipation fins during use. A gear meshed with the annular rack is installed on the rotating part so as to drive the rotating part to move along the through rail. Air injection cleaning can be carried out on gaps among the cooling fins from the side face, even dust in the gaps can be removed, and the situation that the cooling effect of the cooling fins is affected due to dust accumulation after long-term use is avoided.

Description

technical field [0001] The invention belongs to the field of computers, and relates to a computer cooling structure and a processing method thereof. Background technique [0002] At present, in the computer case of the commonly used personal computer, a corresponding cooling system needs to be installed for the purpose of heat dissipation. Since the CPU, graphics card and other components are very hot during operation, it is often further set up on the basis of the heat dissipation structure of the conventional case for the CPU and graphics card. Independent heat sinks for components such as to enhance the heat dissipation effect of these components. In order to enhance heat dissipation, independent heat sinks are often installed on components that generate large amounts of heat, such as the CPU and North Bridge. Usually, the heat sink includes a heat sink assembly composed of multiple heat dissipation fins, and is installed above the heat sink assembly to enhance heat dissi...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a computer heat dissipation structure to solve the problem that in the prior art, the dust in the gaps of the heat dissipation fins cannot be effectively cleaned at the same time when the heat dissipation fins in the chassis are dissipated. The heat dissipation effect of the chip, the technical problem that must be cleaned out of the box regularly

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