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Cutting forming method of wafer-level laminated plastic package wafer

A molding method, wafer-level technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as deformation and impact on bump production

Pending Publication Date: 2021-06-04
JIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this manufacturing process, the edge of the wafer is unconstrained and tends to be deformed, which is no longer the shape of the standard wafer, which affects the subsequent bump production

Method used

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  • Cutting forming method of wafer-level laminated plastic package wafer
  • Cutting forming method of wafer-level laminated plastic package wafer
  • Cutting forming method of wafer-level laminated plastic package wafer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0068] The cutting platform of a kind of wafer-level laminated plastic-encapsulated wafer of the present invention, as Figure 2 to Figure 4 As shown, it includes a cutting knife set 50 , a chassis 70 , a rotating motor 80 and a film waste suction system 90 , and the chassis 70 sucks the molded wafer 20 by vacuum. The rotating motor 80 drives the chassis 70 of the cutting platform to rotate clockwise or counterclockwise.

[0069] The cutter group 50 is arranged on one side of the chassis 70, and it arranges the cutter I51, the cutter II52, the file 58, the cutter III53 and the cutter IV54 sequentially from left to right, the cutter II52, the cutter III53 The file 58 is symmetrical to the center line, and the cutter I 51 and IV 54 are also symmetrical to the file 58; Arranged in an arc shape, an arc is formed around the chassis 70, and the radius of the arc is R3.

[0070] The included angle α between the cutting knife I51 and the cutting knife IV54 is in the range of 90°≤α≤1...

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PUM

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Abstract

The invention relates to a cutting forming method for a wafer-level laminated plastic package wafer, and belongs to the technical field of semiconductor package jigs. A cutting platform comprises a cutting knife set (50), a base plate (70), a rotating motor (80) and a film scrap suction system (90), the base plate (70) sucks a plastic package wafer (20) through vacuum, a cutting knife I (51), a cutting knife II (52), a cutting knife III (53), a cutting knife IV (54) and a file (58) of the cutting knife set (50) sequentially work on the plastic package wafer (20), and edge finishing of the plastic package wafer (20) and finishing of an alignment notch (13) of the plastic package wafer (20) are completed. According to the invention, the edge of the plastic package wafer after the lamination process is finished is trimmed and constrained to form the shape of a standard wafer.

Description

technical field [0001] The invention relates to a cutting and forming method of a wafer-level laminated plastic-encapsulated wafer, and belongs to the technical field of fixtures for semiconductor packaging. Background technique [0002] With the development of the semiconductor industry, wafer-level packaging (wafer WLP) is a typical low-cost and high-efficiency packaging method. There are a large number of mature production lines at home and abroad, but the traditional wafer-level packaging method has also encountered some problems. Limiting factor. In the plastic sealing process, a lamination process is often used, using a curled sheet mold molding compound around the chip, on the back or even on the front, and wrapping the plastic compound through a leveling process, and the plastic compound is generally used as a carrier plate, and proceed to the subsequent bumping process. During this manufacturing process, the edge of the wafer is unconstrained and often deformed, w...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L21/304
CPCH01L21/304H01L21/56
Inventor 陈海杰徐立潘浩朱友义陈栋陈锦辉
Owner JIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTD
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