Temperature sensor, printed circuit board and server

Abstract

The invention discloses a temperature sensor, a printed circuit board, a server, and a board card temperature measurement module arranged at an internal bottom layer, the board card temperature measurement module comprises a crystal grain, a substrate and a bonding pad which is provided with a groove structure and comprises a bare bonding pad and a bonding pad pin, the crystal grain is arranged above the substrate, and the substrate is arranged on the bare bonding pad. The bonding pad pin is arranged on the edge of the groove; and the bare bonding pad is arranged at the bottom of the groove, has no electrical property, and is in direct contact connection with the bonding pad of the circuit board to be subjected to temperature measurement. The crystal grain comprises a temperature sensitive element and a temperature calculation unit and is used for calculating the temperature value of the circuit board to be subjected to temperature measurement according to the temperature information transmitted by the circuit board to be subjected to temperature measurement through the bare bonding pad. According to the invention, the problem that the finally measured temperature cannot accurately reflect the temperature on the board card due to the fact that the pin extending out of the chip body is relatively long, the pin is relatively thin, the heat conduction efficiency is relatively low and the pin is influenced by the air temperature in the existing SOP package is solved, and the temperature measurement precision of the PCB board card is improved.

Description

technical field [0001] The present application relates to the technical field of semiconductors, in particular to a temperature sensor, a printed circuit board and a server. Background technique [0002] With the development of cloud computing applications, informatization has gradually covered all fields of society. More and more daily work and life are communicated through the network, and the corresponding network data volume will continue to increase. The ever-increasing amount of network data has higher requirements on the performance of the underlying server and more complex functions, resulting in an increasing load on the server. The greater the load, the more serious the internal heating of the server. In order to ensure the stable operation of the server, effective server cooling is imminent. [0003] With the increase in demand and the progress of technology, the density of devices on each board that makes up the server is getting higher and higher, and the overa...

AI Technical Summary

Problems solved by technology

[0007] This application provides a temperature sensor, a printed circuit board and a server, which solves the problem that the existing SOP package has a relatively long pin protruding from the chip body, and the pin itself is relatively thin, and the heat conduction efficiency is low. Affected by the air temperature, the final measured temperature cannot accurately reflect the temperature on the board, improving the accuracy of PCB board temperature measurement

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