Packaging substrate and semiconductor structure therewith
A technology for packaging substrates and bodies, applied in semiconductor devices, semiconductor/solid-state device components, and electrical solid-state devices, etc., can solve the problems affecting the connection effect, the overall distortion and deformation of the packaging substrate, and warping, so as to improve performance, increase Anti-twist ability, the effect of reducing warping problems
Active Publication Date: 2022-03-11
CHANGXIN MEMORY TECH INC
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] In the manufacturing process of semiconductor structures, packaging substrates are commonly used. Due to the structural limitations of packaging substrates, packaging substrates are prone to partial distortion or overall warping during use, which affects the connection effect.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0048] Typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different embodiments without departing from the scope of the present invention, and that the description and drawings therein are illustrative in nature and not intended to limit the present invention. invention.
[0049] In the following description of various exemplary embodiments of the invention, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of example various exemplary structures, systems and steps which may implement aspects of the invention . It is to be understood that other specific arrangements of components, structures, exemplary devices, systems and steps may be utilized and structural and functional modifications may be made without departing from the scope of the present invention....
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to the technical field of semiconductors, and provides a packaging substrate and a semiconductor structure having the same. The package substrate includes a body and a conductive layer, the body includes an opening area; the conductive layer is arranged in the opening area, the conductive layer includes a first conductive bridge and a second conductive bridge, and the first conductive bridge and the second conductive bridge are arranged at intervals; wherein, the first conductive The bridge is provided with a first through hole. A first conductive bridge and a second conductive bridge spaced apart are arranged in the opening area, which can enhance the signal transmission quality of the conductive layer, and can increase the twist resistance of the body by controlling the width of the first conductive bridge and the second conductive bridge, while The overall area of the conductive layer can be reduced by providing the first through hole on the first conductive bridge, so as to reduce the warping problem of the main body and improve the usability of the packaging substrate structurally.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a packaging substrate and a semiconductor structure having the same. Background technique [0002] In the manufacturing process of semiconductor structures, packaging substrates are commonly used. Due to the structural limitations of the packaging substrate, the packaging substrate is prone to partial distortion or overall warping during use, which affects the connection effect. Contents of the invention [0003] The invention provides a packaging substrate and a semiconductor structure with the same to improve the performance of the packaging substrate. [0004] According to a first aspect of the present invention, a packaging substrate is provided, including: [0005] a body, the body including the opening area; [0006] A conductive layer, the conductive layer is arranged in the opening area, the conductive layer includes a first conductive bridge and a second condu...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/498
CPCH01L23/49838
Inventor 王海林
Owner CHANGXIN MEMORY TECH INC