Unlock instant, AI-driven research and patent intelligence for your innovation.

Reinforcing resin composition, electronic component, electronic component manufacturing method, mounting structure, and mounting structure manufacturing method

A technology of resin composition and electronic components, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve problems such as contact failure

Pending Publication Date: 2021-06-11
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In particular, if the temperature at the time of heating is high, contact failure may occur

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Reinforcing resin composition, electronic component, electronic component manufacturing method, mounting structure, and mounting structure manufacturing method
  • Reinforcing resin composition, electronic component, electronic component manufacturing method, mounting structure, and mounting structure manufacturing method
  • Reinforcing resin composition, electronic component, electronic component manufacturing method, mounting structure, and mounting structure manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0119] 1. Preparation of resin composition

[0120] A resin composition was obtained by mixing the components shown in Tables 1 and 2 at the ratios shown in Tables 1 and 2. The details of each component shown in Table 1 are as follows:

[0121] EPICLON 835LV: bisphenol F type epoxy resin, in liquid state at 25°C, epoxy equivalent 160-170, viscosity at 25°C 2000-2500mpa·s; product name EPICLON835LV, produced by DIC Corporation.

[0122] • MEH8000H: phenolic resin, in a liquid state at 25°C, with a viscosity of 1500-3500 mPa·s at 25°C; product number MEH-8000H, produced by Meiwa Plastic Industries, Ltd.

[0123] P-d: p-d type benzo An oxazine compound manufactured by SHIKOKU CHEMICALS CORPORATION.

[0124] · 2P4MHZ: 2-phenyl-4-hydroxymethyl-5-methylimidazole, product number 2P4MHZ-PW, manufactured by SHIKOKUCHEMICALS CORPORATION.

[0125] Adipic acid: adipic acid, melting point 152-155°C, produced by Tokyo Chemical Industry Co., Ltd.

[0126] · Succinic acid: succinic acid...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
melting pointaaaaaaaaaa
melting pointaaaaaaaaaa
melting pointaaaaaaaaaa
Login to View More

Abstract

This reinforcing thermosetting resin composition contains: an epoxy resin (A); a phenol resin (B); and a benzoxazine compound (C).

Description

technical field [0001] The present disclosure generally relates to a reinforcing resin composition, an electronic component, a method of manufacturing the electronic component, a mounting structure, and a method of manufacturing the mounting structure. More specifically, the present disclosure relates to a resin composition for reinforcement, an electronic component including a cured product of the resin composition for reinforcement, and a manufacturing method thereof, and a mounting structure including a cured product of the resin composition for reinforcement, and a manufacturing method thereof . Background technique [0002] When the semiconductor chip is mounted on the circuit board, the solder bumps and conductors included in the circuit board are electrically connected. When the bump and the conductor are connected, the joint between the bump and the conductor may be covered and reinforced with a cured product of the resin composition. For example, by placing a resi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/40C08G59/56C08G59/62H01L23/12H05K3/28
CPCH05K3/28C08G59/56H01L23/12C08G59/686C08G59/621C08G59/5046C08G59/245H01L23/291H01L2224/81951H01L2224/16225H01L2224/10126H01L2224/11334H01L2224/11849H01L2224/11013H01L2224/05568H01L2224/10156H01L2224/81815H01L2224/16238H01L2224/16058H01L2224/81862H01L2224/81906H01L24/11H01L24/13H01L24/16H01L24/81H01L2224/81395C08L63/00C08L63/04C08L2203/206C08L2205/02H01L21/563H01L23/293H01L23/3157H01L24/05H01L24/08H01L2224/16227H01L2924/066H01L2924/0665H01L2924/18161
Inventor 山津繁铃木康宽日野裕久
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD