Chip working temperature comparison method in light emitting device manufacturing process
A technology for light-emitting devices, operating temperature, used in thermometers, thermometers using electrical/magnetic components directly sensitive to heat, optical radiation measurement, etc.
Active Publication Date: 2021-06-15
辽宁优欣光科技有限公司
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[0007] In order to solve the technical problems raised by the background technology, the present invention provides a chip operating temperature comparison method in the manufacturing process of light-emitting devices, which aims to detect the actual temperature of different temperature control equipment and power on different numbers of chips in the device at the same time.
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[0039] 1. Use a power-on instrument with temperature control to power-on and temperature-control the uncharged drive chip of the light-emitting device, and use a wavelength meter to detect the wavelength;
[0040] Such as figure 1 As shown, it is the internal structure of the uncharged drive chip of the light emitting device used in the embodiment of the present invention, 1 is an optical chip with a central wavelength of 1295.56, 2 is an optical chip with a central wavelength of 1300.05, and 3 is an optical chip with a central wavelength of 1305.58 , 4 is an optical chip with a central wavelength of 1309.14, and the emitted light of 1, 2, 3, and 4 is resonant divergent light with a certain divergence angle; 5, 6, 7, and 8 are 4 collimating lenses, which act as The divergent light emitted by 2, 3, and 4 is coupled into 4 collimated beams; 9 is a multiplexer, which is designed to use four different filters (9.1, 9.2, 9.3, 9.4) on the light incident side, and the four filters T...
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The invention provides a chip working temperature comparison method in a light emitting device manufacturing process, which comprises the following steps that: 1, power-up temperature control is performed on an uncharged driving chip of a light emitting device by using a power-up instrument with temperature control, and light emitted by the chip is transmitted by using an optical fiber to a wavelength meter for wavelength detection; 2, a direct-current stabilized power supply is matched with software to carry out power-on temperature control on a charged driving chip of the light emitting device, so that the optical chip emits light, the light emitted by the chip is firstly transmitted to a wave separator through an optical fiber, and then the wavelength of each channel is detected through a wavelength meter; 3, the actual temperatures of the optical chip are obtained according to the wavelengths, obtained through the two methods, of the optical chip, and the actual working temperatures are compared; and 4, when the direct-current stabilized power supply is matched with software to carry out power-on temperature control on the charged driving chip of the light emitting device, the actual working temperature is compared with the actual working temperature of the optical chip when one more channel is opened. The invention aims to detect the actual temperature when different temperature control equipment works and different numbers of chips in the device are powered up at the same time.
Description
technical field [0001] The invention relates to the technical field of manufacturing optical communication active light-emitting devices, in particular to a method for comparing chip operating temperatures during the manufacturing process of light-emitting devices. Background technique [0002] The higher the transmission rate, the higher the manufacturing cost of high-end light-emitting devices, and the higher the requirements for wavelength and temperature stability due to the wavelength range and optical components in the manufacturing and use process. [0003] And the reason for the high cost is that most of the high-end optical emitters are equipped with a temperature control element semiconductor cooler TEC. During the manufacturing and use process, it is necessary to use different methods such as temperature-controlled instruments or software to control the temperature of the entire device. At the same temperature, due to the precision and airtight structure of the de...
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IPC IPC(8): G01J9/00G01K7/22
CPCG01J9/00G01K7/22
Inventor 李杨廖传武李志超李浩凡黄芙蓉
Owner 辽宁优欣光科技有限公司