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Multi-band millimeter-wave (MMW) antenna array and radio-frequency integrated circuit (RFIC) module

A technology of radio frequency integrated circuits and antenna arrays, which is applied in the directions of antenna arrays, antennas, circuits, etc., and can solve the problems of limited number of antenna arrays and limited quantity

Active Publication Date: 2021-06-15
QUALCOMM INC
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to size constraints of some electronic devices, the number of antenna arrays that can be implemented may be limited
As a result, an electronic device may be limited in the number of frequency bands it can support or the amount of spatial coverage it can provide at any one time or in a given physical orientation

Method used

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  • Multi-band millimeter-wave (MMW) antenna array and radio-frequency integrated circuit (RFIC) module
  • Multi-band millimeter-wave (MMW) antenna array and radio-frequency integrated circuit (RFIC) module
  • Multi-band millimeter-wave (MMW) antenna array and radio-frequency integrated circuit (RFIC) module

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Embodiment Construction

[0035] Electronic devices use radio frequency (RF) signals to communicate information. These radio frequency signals allow users to talk to friends, download information, share pictures, remotely control household devices, receive global positioning information, use radar for object detection and tracking, listen to radio stations, and more. Some electronic devices include multiple antenna arrays to transmit and receive communication signals at different frequencies or in different directions. However, due to size limitations of some electronic devices, the number of antenna arrays that can be deployed within a given electronic device may be limited. As a result, electronic devices may be limited in the number of frequency bands they can support or the amount of spatial coverage they can achieve.

[0036] To address such challenges, this paper describes techniques for implementing multiband millimeter wave (mmW) antenna arrays and radio frequency integrated circuit (RFIC) modul...

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Abstract

An apparatus is disclosed for a multi-band millimeter-wave (mmW) antenna array and radio-frequency integrated circuit (RFIC) module. In an example aspect, the apparatus includes a multi-band mmW antenna array and RFIC module with a first antenna array, a second antenna array, and at least one radio-frequency front-end integrated circuit. The first antenna array includes at least two first antenna elements and is tuned to a first mmW frequency band. The second antenna array includes at least two second antenna elements and is tuned to a second mmW frequency band. The at least one radio-frequency front end integrated circuit includes at least two first transceiver chains and at least two second transceiver chains. The at least two first transceiver chains are respectively coupled to the at least two first antenna elements, and the at least two second transceiver chains are respectively coupled to the at least two second antenna elements.

Description

[0001] Cross References to Related Applications [0002] This patent application claims priority to non-provisional application No. 16 / 178,189, filed November 1, 2018, entitled "MULTI-BAND MILLIMETER-WAVE (MMW) ANTENNA ARRAY AND RADIO-FREQUENCY INTEGRATED CIRCUIT (RFIC) MODULE" , this non-provisional application is assigned to the assignee of the present invention and is hereby expressly incorporated by reference herein. technical field [0003] The present disclosure relates generally to antenna arrays and wireless transceivers, and more particularly to joint antenna array and radio frequency integrated circuit (RFIC) designs implementing multiband millimeter wave (mmW) antenna arrays and RFIC modules. Background technique [0004] Electronic devices use radio frequency (RF) signals to communicate information. These radio frequency signals allow users to chat with friends, download information, share pictures, remotely control household devices, and receive global positio...

Claims

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Application Information

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IPC IPC(8): H04B1/00
CPCH04B1/50H04B1/0064H01Q21/00H01Q1/2283H01Q1/243H01Q1/40H01Q21/245H01Q21/30H01Q5/28H01Q5/35H01Q5/50
Inventor K·查克拉博思R·马利克J·邓沃斯
Owner QUALCOMM INC
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