A printed circuit board silk screen scraper assembly and solder resist ink filling system

Abstract

The application provides a printed circuit board silk screen scraper assembly, including: a mounting tube and a scraper. The installation tube includes an upper cavity and a lower cavity. The upper cavity is provided with a feed joint, and the lower cavity is provided with an outlet joint. The lower section of the installation tube includes a front side wall and a rear side wall, and the front side wall and the rear side wall A discharge port for the solder resist ink is provided between the ends of the scraper, and the discharge port faces the direction opposite to the moving direction of the scraper assembly. Both ends of the installation pipe are provided with end caps. The length of the scraper is the same as the length of the discharge port. The two ends of the scraper are connected to the end caps at both ends. The top of the scraper and the bottom of the rear side wall are rotationally matched, and the distance between the side of the scraper and the end of the front side wall is adjustable. . At the same time, a printed circuit board solder resist ink filling system is provided, which includes the above-mentioned printed circuit board silk screen scraper assembly and a feeding device, and the feeding device includes a material storage tank and a stirrer. The solution of the present application can prevent defective printed circuit boards, avoid damage to the screen board, and improve production efficiency.

Description

technical field [0001] The invention belongs to the field of printed circuit board production and manufacturing, and in particular relates to a printed circuit board silk screen scraper assembly and a solder resist ink filling system. Background technique [0002] The silk screen printing process of printed circuit boards refers to the process of applying a layer of solder resist ink after the wiring diagram of printed circuit boards is completed. At present, most silk screen printing machines are used for silk screen printing. The stencil moves in a straight line, and then the screen printing stencil uses the pre-processed screen printing pattern when the solder resist ink penetrates the screen printing stencil and then adheres to the printed circuit board. [0003] In the prior art, the solder resist ink is usually poured directly on the screen printing screen during silk screen printing, and then scraped with a scraper to achieve the purpose of screen printing, and most o...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the solder resist ink is usually poured directly on the screen printing screen during silk screen printing, and then scraped with a scraper to achieve the purpose of screen printing, and most of the prior art uses manual addition of solder resist ink, that is, the operator adds the solder resist ink on the screen printing screen. Observe the amount of ink on the screen at any time during the process. When the solder resist ink is insufficient, stop the operation of the equipment, and then add it manually. The process of adding solder resist ink will greatly affect production efficiency, and if the operator does not add solder resist ink in time, it will be Due to the lack of solder resist ink in the stencil, the quality of the printed circuit board is poor, and the stencil may even be scratched due to the lack of solder resist ink on the stencil.

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