Manufacturing method of packaging structure and packaging structure

A technology of packaging structure and manufacturing method, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc. process, improve the flow capacity, and the effect of simple production method

Active Publication Date: 2021-06-18
SKY CHIP INTERCONNECTION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, in order to achieve high integration, miniaturization and miniaturization of products, package in package (PiP), package on package (PoP) or system in package (System in Package) are generally used. , SiP) to package each component; however, the packaging structure in the prior art has a relatively complicated manufacturing method, and its heat dissipation and flow capacity are relatively weak

Method used

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  • Manufacturing method of packaging structure and packaging structure
  • Manufacturing method of packaging structure and packaging structure
  • Manufacturing method of packaging structure and packaging structure

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0027] The terms "first", "second", and "third" in this application are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, features defined as "first", "second", and "third" may explicitly or implicitly include at least one of these features. In the description of the present application, "plurality" means at least t...

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PUM

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Abstract

The invention provides a manufacturing method of a packaging structure and the packaging structure. The manufacturing method comprises the steps of obtaining a packaging body; wherein the packaging body comprises a carrier plate, an electronic component, a through-flow column and a packaging layer, the electronic component and the through-flow column are arranged on at least one surface of the carrier plate, and the packaging layer is arranged on the surface of the side, away from the carrier plate, of the electronic component and makes contact with the carrier plate to package the electronic component and the through-flow column; pressing the surface of one side of the packaging body to form a pressing layer; processing a preset position of the pressing layer to form a plurality of external pins; wherein the positions of at least part of the external pins correspond to the position of the through-flow column, the through-flow column is communicated with external equipment through the external pins, and the transverse area of the external pins is larger than that of the through-flow column. According to the manufacturing method, the process is relatively simple, and the heat dissipation and through-current capability of the manufactured packaging structure is effectively improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a method for manufacturing a packaging structure and the packaging structure. Background technique [0002] In today's information society, human beings are increasingly dependent on electronic products, and electronic products are developing vigorously in the direction of high integration, miniaturization, and miniaturization. [0003] At present, in order to achieve high integration, miniaturization and miniaturization of products, package in package (PiP), package on package (PoP) or system in package (System in Package) are generally used. , SiP) to package each component; however, the packaging structure in the prior art has a relatively complicated manufacturing method, and its heat dissipation and flow capacity are relatively weak. Contents of the invention [0004] The manufacturing method and the packaging structure provided in the present application ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L23/49H01L21/56
CPCH01L25/072H01L23/49H01L21/561H01L25/07H01L21/56H01L23/498H01L2224/16225
Inventor 张强波张伟杰宋关强
Owner SKY CHIP INTERCONNECTION TECH CO LTD
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