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Mountable electronic component and electronic circuit module

A technology for electronic components and electrical functional parts, which is applied in the direction of printed circuits, circuits, and electrical components connected to non-printed electrical components, which can solve problems such as large plane area and achieve the effect of suppressing large-scale

Pending Publication Date: 2021-06-22
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in general, a semiconductor substrate has a larger planar area than a chip part

Method used

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  • Mountable electronic component and electronic circuit module
  • Mountable electronic component and electronic circuit module
  • Mountable electronic component and electronic circuit module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] A mount-type electronic component according to a first embodiment of the present invention will be described with reference to the drawings. figure 1 It is a side sectional view showing the structure of the mounted electronic component of 1st Embodiment. figure 2 (A) is a top view showing the structure of the mounted electronic component of the first embodiment, figure 2 (B) is a bottom view showing the configuration of the mounted electronic component of the first embodiment.

[0028] Such as figure 1 , figure 2 of (A), figure 2 As shown in (B), the packaged electronic component 10 includes a substrate 20 , a first electronic component 31 , a second electronic component 32 , a mold resin 41 , a mold resin 42 , and a terminal conductor 50 .

[0029] The substrate 20 is a substantially rectangular flat plate having sides parallel to the first direction and the second direction and viewed from the thickness direction. The substrate 20 has a first main surface 201...

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PUM

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Abstract

In the present invention, a substrate (20) has a first main surface (201) and a second main surface (202). A first electronic component (31) is mounted on the substrate (20) such that one surface (311) on which an electric function part is formed faces the first main surface (201). A second electronic component (32) is mounted on the substrate (20) such that one surface (321) on which an electric function part is formed faces the second main surface (202). The first electronic component (31) and the second electronic component (32) at least partially overlap each other in a plan view. The other surface (312) of the first electronic component (31) is exposed from a mold resin (41). The other surface (322) of the second electronic component (32) is exposed from a mold resin (42).

Description

technical field [0001] The present invention relates to a mounted electronic component that includes a plurality of electronic components having an electrical function portion formed on one surface side and that can be mounted on another circuit board. Background technique [0002] The module described in Patent Document 1 includes a wiring board, a plurality of chip components, and a semiconductor substrate. A semiconductor substrate is mounted on one surface of the wiring board, and a plurality of chip components are mounted on the other surface of the wiring board. [0003] Patent Document 1: International Publication No. 2014 / 017228 [0004] In the configuration shown in Patent Document 1, a plurality of semiconductor substrates are provided, and these plurality of semiconductor substrates and chip components must be mounted on the same surface in some cases. [0005] However, in general, a semiconductor substrate has a larger planar area than a chip component. Theref...

Claims

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Application Information

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IPC IPC(8): H01L23/00H01L23/28H01L25/00H01L25/065H01L25/07H01L25/18H05K1/18H05K3/28
CPCH05K1/18H01L25/065H05K3/28H01L25/07H01L25/18H01L25/00H01L25/0657H01L2225/06517H01L2225/06572H01L23/5385H01L2224/16227H01L2924/18161H01L2924/3025H10N30/88H01L23/31H10N30/875
Inventor 楠山贵文越川祥高
Owner MURATA MFG CO LTD