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Cleaning device for monolithic wafers

A cleaning device, a single-chip technology, applied in the direction of cleaning methods using liquids, cleaning methods and utensils, electrical components, etc., can solve problems such as inability to perform batch cleaning, poor cleaning effect, and small volume of semiconductor devices

Inactive Publication Date: 2021-06-25
JIANGSU ASIA ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the continuous improvement of integrated circuit manufacturing technology, the volume of semiconductor devices is becoming smaller and smaller, which also leads to very small particles becoming enough to affect the manufacture and performance of semiconductor devices. The thinner the wafer is, the more stringent the developing process is, the slot developing process can no longer meet the demand, so the single-wafer cleaning and developing process begins to play more and more roles in the semiconductor manufacturing process
[0003] The existing single-piece wafer cleaning device cannot perform batch cleaning on both sides of the wafer after the single piece is fixed, so the cleaning effect is not good and the cleaning efficiency is low

Method used

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  • Cleaning device for monolithic wafers
  • Cleaning device for monolithic wafers
  • Cleaning device for monolithic wafers

Examples

Experimental program
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Embodiment 1

[0033] see Figure 1-Figure 7, the present invention provides a technical solution: a cleaning device for a single-piece wafer, including a gap rotation mechanism 1, a fixing mechanism 2, and a cleaning mechanism 3, and the gap rotation mechanism 1 includes a bottom plate 101, a shaft support 102, and a shaft 103 , worm gear 104, worm screw 105, the top of the bottom plate 101 is supported by a rotating shaft bracket 102 with a rotating shaft 103, one end of the rotating shaft 103 is keyed to a worm wheel 104, the other end of the rotating shaft 103 is fixed with a turntable 108, one side of the worm wheel 104 is meshed with a worm 105, and the worm 105 is keyed On the output shaft of the motor one 106, the motor one 106 is fixedly installed on the rotating shaft support 102 through the motor support 107, and the fixing mechanism 2 includes a connecting frame 201, a sliding bracket 202, a sliding sleeve 203, a sliding rod 204, and a limit plate one 205, The outer side of the t...

Embodiment 2

[0037] see Figure 8 The difference between embodiment 2 and embodiment 1 is that the cleaning mechanism 3 includes a cleaning box 301, a fixed plate 306, a water spray nozzle 2 307, the base plate 101 is provided with a cleaning box 301, and the cleaning box 301 inner wall is fixed with a fixed plate 306, The fixed disk 306 is provided with a water spray head 2 307, and the water spray head 2 307 is multiple. The water spray head 2 307 can clean both sides of the entire wafer. When the wafer needs to be fixed, the wafer to be cleaned is placed on the Between the two suction cups 211, push the limit plate 3 212 through the spring 2 213 and then pull the support rod 209 and the offset plate 210, then reduce the distance between the suction cups 211 to absorb and fix the wafer, pull the offset plate 210 and then pull the suction cup 211 and then the wafer can be taken out. When the wafer needs to be cleaned, then start the motor 106 to drive the worm 105 to rotate intermittently...

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Abstract

The invention belongs to the field of cleaning devices, and particularly relates to a cleaning device for monolithic wafers. The cleaning device comprises a gap rotating mechanism, a fixing mechanism and a cleaning mechanism. The gap rotating mechanism comprises a bottom plate, a rotating shaft support, a rotating shaft, a worm gear and a worm, and the top end of the bottom plate supports the rotating shaft through the rotating shaft support. One end of the rotating shaft is in key connection with the worm gear, a rotating disc is fixed to the other end of the rotating shaft, one side of the worm gear meshes with the worm, the worm is in key connection with an output shaft of a first motor, and the first motor is fixedly installed on the rotating shaft support through a motor support. The fixing mechanism comprises a connecting frame, a sliding support, a sliding sleeve, a sliding rod and a first limiting plate. The gap rotating mechanism and the fixing mechanism are adopted, so that a plurality of monolithic wafers can be fixed at the same time and conveyed into the cleaning mechanism to be cleaned. The cleaning efficiency is high, the cleaning mechanism can clean the two faces of each wafer at the same time, and the cleaning effect is good.

Description

technical field [0001] The invention belongs to the field of cleaning devices, in particular to a cleaning device for a single wafer. Background technique [0002] With the continuous improvement of integrated circuit manufacturing technology, the volume of semiconductor devices is becoming smaller and smaller, which also leads to very small particles becoming enough to affect the manufacture and performance of semiconductor devices. The thinner the wafer is, the more stringent the development process of the wafer is, and the tank development process can no longer meet the demand. Therefore, the single-wafer cleaning and development process begins to play more and more roles in the semiconductor manufacturing process. [0003] The existing single wafer cleaning device cannot clean both sides of the wafer at the same time after the single wafer is fixed in batches, so the cleaning effect is not good and the cleaning efficiency is low. Contents of the invention [0004] In ...

Claims

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Application Information

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IPC IPC(8): B08B3/02B08B13/00H01L21/67
CPCB08B3/02B08B13/00H01L21/67051
Inventor 钱诚李刚刘青松
Owner JIANGSU ASIA ELECTRONICS TECH CO LTD