TFT circuit substrate production process

A production process and circuit substrate technology, applied in the direction of circuit substrate materials, printed circuits, printed circuit manufacturing, etc., can solve the problems of low precision of TFT circuit substrates, and achieve the effect of prolonging service life and high graphic accuracy

Inactive Publication Date: 2021-06-29
深圳市昱安旭瓷电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a TFT circuit substrate production process, aiming to solve the problem of low precision of the TFT circuit substrate produced in the prior art

Method used

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Embodiment Construction

[0012] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0013] A TFT circuit substrate production process, comprising the following steps:

[0014] Selecting a base material, the base material is made of glass or ceramics;

[0015] performing surface treatment on the substrate, sputtering a thin transition metal layer on the surface of the substrate by vacuum sputtering;

[0016] A high-resolution exposure dry film is pasted on the surface of the transition metal thin layer, and an inscribed circuit pattern is exposed on the substrate by an exposure machine;

[0017] Electroplate the circuit pattern on the substrate by pulse electroplating, remove the exposed dry film, remove ...

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Abstract

The invention relates to the technical field of circuit substrate production, and discloses a TFT circuit substrate production process. The process comprises the following steps: selecting a base material which is made of glass or ceramic; carrying out surface treatment on the base material, and sputtering a transition metal thin layer on the surface of the base material through a vacuum sputtering method; pasting a high-resolution exposure dry film on the surface of the transition metal thin layer, and exposing a shadow line pattern on the base material through an exposure machine; electroplating a circuit pattern on the base material through pulse electroplating, removing the exposure dry film, removing the transition metal thin layer formed by vacuum sputtering, and performing gold immersion or other protection treatment on the circuit surface on the base material; and cutting the base material into a required size by a laser to obtain a finished product. The base material made of glass or ceramic materials with good dimensional stability is selected, meanwhile, the circuit pattern is manufactured through a vacuum sputtering method, pattern precision is high, glass or ceramic is used as the base material, heat generated by long-term work of a product can be effectively dissipated, and the service life of the product is prolonged.

Description

technical field [0001] The invention relates to the technical field of circuit substrate production, in particular to a TFT circuit substrate production process. Background technique [0002] At present, with the refined development of electronic products, the volume of electronic products is required to be smaller and smaller. In the past year, with the development of Micro LED technology, LED backlights have been thinned, miniaturized, and arrayed, requiring LED units of 50~ 100 microns, like OLED, each pixel can be individually customized and driven to emit light individually. It not only inherits the high efficiency, high brightness, high reliability and fast response time of inorganic LEDs, but also has the characteristics of self-illumination without backlight, small size, light and thin, and can easily achieve energy-saving effects. This makes the requirement for the accuracy of the TFT board greatly improved, and 300 to 500 (or even more) tiny LED grains need to be ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K3/00H05K3/18
CPCH05K1/0306H05K3/0011H05K3/188
Inventor 王鹤杰王鹤尧
Owner 深圳市昱安旭瓷电子科技有限公司
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