A double-sided circuit board and method of making the same
A technology of double-sided circuit boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problem that the double-sided board manufacturing process cannot meet the high-precision circuit production, and achieve high plate-making efficiency and process simple effect
Active Publication Date: 2022-08-02
BEIJING DREAM INK TECH CO LTD
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Problems solved by technology
[0004] In view of this, an object of the present invention is to propose a method for manufacturing double-sided circuit boards, so as to solve the problem that the manufacturing process of double-sided boards in the prior art cannot meet the production requirements of high-precision circuits.
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[0022] The following description and drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, process, and other changes. The examples represent only possible variations. Unless expressly required, individual components and functions are optional and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of embodiments of the invention includes the full scope of the claims, along with all available equivalents of the claims. These embodiments of the invention may be referred to herein by the term "invention," individually or collectively, for convenience only and not to automatically limit the application if more than one invention is in fact disclosed. The scope is any single invention or inventive concept.
[0023] It should be noted that each tech...
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Abstract
The invention discloses a double-sided circuit board and a manufacturing method thereof, and relates to the technical field of electronic circuit preparation; the manufacturing method of the double-sided circuit board comprises: preparing a base material; forming a first surface on the first surface of the base material conductive layer; etching the first conductive layer with a first laser beam to form a first conductive circuit on the first surface of the base material; forming a second conductive layer on the second surface of the base material; using The second laser beam etches the second conductive layer to form second conductive lines on the second surface of the substrate. In the embodiment of the present invention, the conductive layer formed on the substrate is processed by the laser etching process, and the high-precision performance of the laser beam can be used to complete the production of high-precision circuit boards, and the process is simple, the plate-making efficiency is high, and industrialization can be achieved. Plate making requirements.
Description
technical field [0001] The invention belongs to the technical field of electronic circuit fabrication, and in particular relates to a double-sided circuit board and a fabrication method thereof. Background technique [0002] With the development of high technology, people need electronic products with high performance, small size and multiple functions, which promotes the development of printed circuit board manufacturing to light, thin, short and small, so as to use limited space to achieve more functions and increase the wiring density , targets with smaller apertures. [0003] Double-sided circuit board (also known as double-sided board) refers to the circuit structure formed on both sides of the same substrate. Conductive lines, this process has problems such as complex procedures, low efficiency, and a large amount of pollution, and will be gradually replaced in the future. In recent years, it has been proposed to complete double-sided plate making through a printing p...
Claims
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IPC IPC(8): H05K3/02H05K1/11
CPCH05K3/027H05K1/11
Inventor 鲁强赵建慧赵先福吕文峰
Owner BEIJING DREAM INK TECH CO LTD