Image calibration device and method for mark on printed board

Abstract

The invention discloses an image calibration device and method for a mark on a printed board, the image calibration device for the mark on the printed board comprises a board feeding unit, a main camera unit, an auxiliary camera unit and a control system, and the image calibration method for the mark on the printed board comprises the following steps: fixing and conveying the printed board by the board feeding unit; the auxiliary camera unit preliminarily shoots a printing plate image, uploads the image to a control system display screen, clicks to determine an image where the mark position is located, then the main camera unit converts the determined position image of the mark into a view, fine adjustment of mark coordinates is carried out, and after the mark position is fine adjusted, clicks, stores and establishes coordinate parameters of the mark, and the mark is calibrated; and then the control system controls the main camera unit to be converted into a view mode, the mark on the printed board is calibrated or scanned and recognized, and the calibration, calibration or detection work of the mark can be completed after calibration or scanning is completed. The calibration method is irrelevant to the shape of the printed board, and the mark calibration is more accurate and rapid.

Description

technical field [0001] The invention relates to the technical field of calibration of markings on printed boards, in particular to an image calibration device and method for markings on printed boards. Background technique [0002] In the production process of circuit boards in today's electronics manufacturing industry, it is usually necessary to print solder paste on the circuit board, and then connect the electronic parts to the circuit board through a reflow furnace. During the process on the circuit board, solder paste needs to be applied to a specific position on the circuit board, and the amount of solder paste needs to be controlled. Therefore, it is necessary to use a precise special stencil to control the printing of solder paste. Now commonly used solder paste printing machines are generally composed of plate loading, solder paste, embossing, and circuit board delivery. Its working principle is: first fix the circuit board to be printed on the printing positioning...

AI Technical Summary

Problems solved by technology

[0003] During the board loading process, it is necessary to calibrate the mark point and the positioning base point of the circuit board. The calibration mark point is used to correspond to the stencil printing solder paste. The calibration positioning base point can be It is used to place thimble pins to fix the circuit board at a fixed point. After the circuit board is produced, it is necessary to identify and detect the two-dimensional code or barcode or other image marks. Traditionally, the mark point and the positioning base point are manually measured with a vernier caliper. Mark point or Position the distance between the base point and the two sides, and then input it into the control system and save it as the coordinate parameter. For regular circuit boards, it is impossible to determine its boundary reference line or accurately determine its boundary reference line, which will make it impossible for some circuit boards to measure the distance between the mark point or the positioning base point and the two sides with a vernier caliper, making it impossible for some circuit boards to measure accurately The distance between the mark point or the positioning base point and the two sides will lead to inaccurate calibration of the mark point or positioning base point, so that the circuit board cannot be accurately aligned with the printed stencil or cannot be accurately positioned

The traditional detection of two-dimensional codes or barcodes or other image marks is basically done manually by using other equipment to scan and detect, which leads to a large amount of manual labor and high labor costs.

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