A kind of quantum cascade laser chip and preparation method thereof

A quantum cascade, laser technology, applied in lasers, phonon exciters, laser parts and other directions, can solve the problem of quantum cascade laser response rate and heat dissipation contradiction, to improve heat dissipation, increase response rate, reduce parasitic capacitance Effect

Active Publication Date: 2022-07-12
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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  • Abstract
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  • Claims
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Problems solved by technology

[0003] In the process of realizing the concept of the present disclosure, the inventors found that there are at least the following problems in the related technology, there is a contradiction between the response rate of the quantum cascade laser and the heat dissipation

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  • A kind of quantum cascade laser chip and preparation method thereof
  • A kind of quantum cascade laser chip and preparation method thereof
  • A kind of quantum cascade laser chip and preparation method thereof

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Embodiment Construction

[0046] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood, however, that these descriptions are exemplary only, and are not intended to limit the scope of the present disclosure. In the following detailed description, for convenience of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent, however, that one or more embodiments may be practiced without these specific details. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concepts of the present disclosure.

[0047] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the present disclosure. The terms "comprising", "comprising" and the like used herein indicate the presence of s...

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Abstract

Embodiments of the present disclosure provide a quantum cascade laser chip and a preparation method. The quantum cascade laser chip includes: a substrate; a double groove ridge structure, the double groove ridge structure is arranged on the substrate; a first electrode, the first electrode is arranged on the target surface of the double groove ridge structure; two semi-insulating filling layers , two semi-insulating filling layers are respectively arranged in the grooves opened on two sides of the double-groove ridge structure to form a semi-insulating buried structure for the semi-insulating filling layer; two auxiliary ridge structures, each auxiliary ridge structure is arranged on the lining On the bottom, two auxiliary ridge structures are respectively arranged on opposite sides of the double-groove ridge structure; and two second electrodes, which are respectively arranged on the two auxiliary ridge structures, and the target surface of the first electrode is in contact with the second electrode. The height difference between the target surfaces of the two electrodes is less than or equal to the first distance threshold. The quantum cascade laser chip can improve the heat dissipation while increasing the response rate.

Description

technical field [0001] The invention relates to the technical field of infrared optoelectronic devices, in particular to a quantum cascade laser chip and a preparation method thereof. Background technique [0002] Quantum Cascade Laser (QCL) is a semiconductor laser capable of emitting laser light in the mid-infrared and far-infrared wavelengths. For the infrared quantum cascade laser whose emission wavelength is located in the atmospheric window of 3-5 μm or 8-14 μm, it has the advantages of small size, low power consumption, tunable wavelength, large design flexibility and high response rate. Moreover, due to its long emission wavelength and weak scattering by atmospheric particles, it has unique advantages in space communication and gas detection. [0003] In the process of realizing the concept of the present disclosure, the inventors found that the related art has at least the following problems, that there is a contradiction between the response rate of the quantum ca...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/042H01S5/024H01S5/22
CPCH01S5/04256H01S5/024H01S5/2202H01S5/2206
Inventor 杨科刘俊岐刘峰奇梁平胡颖张锦川翟慎强卓宁王利军刘舒曼
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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