Device and method for rework and rework of integrated devices with microwave component bonding process
A technology of integrated devices and microwave components, applied in the directions of printed circuit maintenance/correction, printed circuit secondary treatment, etc., can solve the problem of rework and rework devices for integrated devices with no bonding process, and bonded devices with high-density hybrid integrated microwave components. Rework and repair devices and methods, etc., to achieve the effect of shortening rework and repair time, improving rework and repair efficiency, and efficient rework and repair
Active Publication Date: 2022-02-15
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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Chinese patent 201110266688.4 "A Method for Transferring Paste Flux During BGA Device Rework" discloses a process method for accurately controlling the height of paste flux on the surface of solder balls during BGA device rework, which can prevent BGA solder balls from BGA components or printed boards are scrapped due to improper soldering
[0005] There are many patents on rework and repair devices for BGA, diodes, QFN devices, SMT electrical components, photovoltaic cell strings, etc. A rework and rework device for bonding process-integrated devices, especially no other rework and rework device and method for high-density hybrid integrated microwave components bonded devices
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[0030] All features disclosed in all embodiments in this specification, or steps in all implicitly disclosed methods or processes, except for mutually exclusive features and / or steps, can be combined and / or extended and replaced in any way.
[0031] Such as Figure 1~3 As shown, a rework and rework device for microwave component bonding process integrated devices includes a lower tray and an upper cover part. The lower tray is placed on the workbench, and the upper cover part is placed on the lower tray. The lower tray and the upper cover The components are connected by bolts, and the reworked products are clamped between the lower tray and the upper cover plate components, and the distance between the lower tray and the upper cover plate components can be adjusted according to the different sizes of the products; the lower tray is processed with counterbores for bolt installation The upper cover part includes a pressing plate, an acrylic plate and a base plate, and the same p...
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The invention discloses a device and method for reworking and repairing an integrated device of a microwave component bonding process. The device includes a lower tray and an upper cover part. The pallet and the upper cover parts are connected by bolts, the reworked products are clamped between the lower pallet and the upper cover parts, and the distance between the lower pallet and the upper cover parts can be adjusted according to the different sizes of the products; the lower pallet is processed with bolts The counterbore is installed; the upper cover plate components include a pressure plate, an acrylic plate and a bottom plate, etc.; the present invention can realize economical and efficient rework and repair of bonding devices of high-density hybrid integrated microwave components, and can meet the rework and repair of bonding devices of different sizes and different positions , It can realize the cold prying of the device, avoiding the secondary damage to the intact device and interconnection wire by the operator and the spatter during the prying process, and reducing the heating process, shortening the rework and repair time, and improving the rework and rework efficiency.
Description
technical field [0001] The invention relates to the technical field of bonding device rework and repair, and more specifically, relates to a device and method for rework and repair of microwave component bonding process integrated devices. Background technique [0002] The semiconductor integrated circuit completes the electronic interconnection on the chip. On the basis of the semiconductor integrated circuit, hybrid integrated circuit technologies such as wire bonding, ribbon bonding, bonding, and brazing promote the continuous development of electronic equipment and products to be thinner, lighter, and smaller. Hybrid integrated microwave Components present the characteristics of integration, high density, small batches, and multiple varieties. In hybrid integrated microwave components, components such as bare die, microwave printed circuit chip, thin film circuit chip and LTCC circuit chip are mostly integrated by bonding process. During the product debugging process, th...
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IPC IPC(8): H05K3/22
CPCH05K3/225
Inventor 方杰刘川崔西会张香朋苟中月许冰伍泽亮廖伟何东吴婷史平怡陈绪波代忠
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP