Heat dissipation silica gel sheet with embedded heat conduction groups

Abstract

The invention discloses a heat dissipation silica gel sheet embedded with heat conduction groups, and belongs to the technical field of silica gel heat dissipation, heat at a heating element is conducted to a radiator through cooperation of an outer silica gel layer, an inner silica gel layer, a metal heat conduction layer and a flexible connection layer which are stacked layer by layer, and a plurality of heat conduction groups are embedded between the outer silica gel layer and the inner silica gel layer, the heat conduction group is composed of heat conduction balls and heat conduction pipes which are directly distributed between the outer silica gel layer and the inner silica gel layer, heat is transmitted in the radial direction, the heat conduction effect of the silica gel sheet is effectively improved, the flexible connection layer filled with the flexible heat conduction filler is arranged on the outer side of the metal heat conduction layer, the flexible connection layer has elasticity and high flexibility, and when attached to the heating element, the heating element can be extruded, matched and tightly attached to one end of the heating element by means of the flexibility of the heating element, and after attachment, the air nozzle is used for blowing air into the filling cavity, so that the attachment degree is further improved, an overlarge gap between the heating element and the air nozzle is effectively avoided, and the heat conduction effect is effectively improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of silica gel, and more specifically relates to a heat dissipation silica gel sheet embedded with a heat conduction group. Background technique [0002] All kinds of electronic products are widely used in my life, ranging from large TVs to small MP3 players. All electronic products will involve a problem of heat dissipation, because the temperature of the electronic components in electronic products will increase during use. Increase, especially transistors and some semiconductor components are particularly prone to heat. When these electronic components are at a high temperature, their performance will decrease. At this time, it is necessary to dissipate heat from these electronic components. [0003] At present, heat sinks are generally used to dissipate heat from electronic products, and a silica gel sheet is usually used between the heat sink and the heating element to conduct heat. ...

AI Technical Summary

Problems solved by technology

At present, when the actual heat dissipation is used, it is often just to set an ordinary silica gel sheet between the radiator and the heating element, and its heat conduction effect needs to be improved; There is a gap between them, which will easily cause poor heat transfer of the heating element, resulting in poor heat dissipation. In some cases, it is necessary to design a silicone sheet that matches the shape of the heating element. The scope of application is not wide, and the applicability needs to be improved.

Images