A method and device for friction-assisted riveting of ultra-thin plates

Abstract

The invention discloses a method and a device for friction-assisted riveting of ultra-thin plates, belonging to the technical field of metal connection. The method adopts the method of extruding the punch to load and unload the magnetorheological elastic ring for many times, and makes use of the friction between the magnetorheological elastic ring and the plate to make the ultra-thin plate flow into the concave die and form in the concave die. Finally, the convex ultra-thin plate is extruded and deformed by a forming punch to form a mechanical lock to realize the connection of the ultra-thin plate. The method has good compatibility with the existing equipment, simple operation steps, easy to realize automatic production, greatly improves the efficiency of connection, avoids the damage of the base material during the deformation process under the premise of ensuring the reliable connection strength, and improves the economy. sex.

Description

technical field [0001] The invention belongs to the technical field of metal connection, and in particular relates to a method and a device for friction-assisted riveting of ultra-thin plates. Background technique [0002] Plastic connection has been widely used in engineering and manufacturing in recent years due to its advantages such as no need for auxiliary materials (rivets, etc.), high efficiency and energy saving, the ability to connect heterogeneous materials, and low requirements for equipment. , flat bottom riveting, double-sided self-piercing riveting, laser impact riveting, etc. have been developed rapidly, and have played an important role in the riveting of conventional wall thickness plates. For example, the riveted connection relies on the plastic deformation between the plates to form a mechanical lock, which requires no additional materials, is more economical, does not pollute the environment, is simple to form, and is easy to automate. [0003] Thin-wall...

AI Technical Summary

Problems solved by technology

The existing conventional riveting process can easily cause the plate to break, and if the prefabricated hole is used, there will be a problem of destroying the strength of the base metal

At present, the ultra-thin plate joining process mainly includes laser shock riveting or glue bonding. The laser shock riveting process requires special equipment, the device structure is relatively complicated, and the cost is high; while glue bonding has the disadvantages of low strength and poor reliability.

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