Thermoelectric refrigerator, preparation method of thermoelectric refrigerator and electronic equipment

A thermoelectric cooler and thermoelectric technology, applied in the field of electronics, can solve the problems of complex manufacturing process and high cost of aluminum nitride ceramics

Pending Publication Date: 2021-07-16
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the manufacturing process of aluminum nitride ceramics is relatively complicated and the cost is high, and the cost of the substrate accounts for 20-30% of the manufacturing cost of the thermoelectric cooler.

Method used

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  • Thermoelectric refrigerator, preparation method of thermoelectric refrigerator and electronic equipment
  • Thermoelectric refrigerator, preparation method of thermoelectric refrigerator and electronic equipment
  • Thermoelectric refrigerator, preparation method of thermoelectric refrigerator and electronic equipment

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Embodiment Construction

[0034] The thermoelectric refrigerator provided by the embodiment of the present invention can be applied to various electronic devices, and is used to control the temperature of the temperature-controlled structure in the electronic device, so that the temperature of the temperature-controlled structure can be kept at the set temperature, so as to improve the temperature of the temperature-controlled structure. Structural performance and reliability. The cost of the thermoelectric cooler in the prior art is relatively high, and the cost of the substrate accounts for 20% to 30% of the manufacturing cost of the high-performance thermoelectric cooler. Therefore, the cost of the substrate can be reduced to reduce the manufacturing cost of the thermoelectric cooler, and It is necessary to maintain a high thermal conductivity of the substrate. Therefore, the present invention provides a thermoelectric cooler, a preparation method of the thermoelectric cooler and electronic equipmen...

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Abstract

The invention provides a thermoelectric refrigerator, a preparation method of the thermoelectric refrigerator and electronic equipment. The thermoelectric refrigerator comprises two single crystal silicon substrates arranged oppositely and a plurality of semiconductor thermoelectric particles located between the two single crystal silicon substrates, wherein one side, facing the semiconductor thermoelectric particles, of each single crystal silicon substrate is provided with an insulating layer, and a conducting sheet is arranged between the insulating layer and the semiconductor thermoelectric particles, and is electrically connected with the semiconductor thermoelectric particles, so that the semiconductor thermoelectric particles can form a series connection circuit, wherein due to the fact that the semiconductor thermoelectric particles have the thermoelectric effect, the two monocrystalline silicon substrates of the thermoelectric refrigerator can conduct refrigeration and heating respectively. According to the invention, the monocrystalline silicon substrate is used as the substrate of the thermoelectric refrigerator, and the cost of the monocrystalline silicon substrate is low, so that the cost of the thermoelectric refrigerator is low.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a thermoelectric cooler, a preparation method of the thermoelectric cooler and electronic equipment. Background technique [0002] Optical devices are important devices in the field of optical communications, and the internal chips of many optical devices are highly sensitive to temperature. In order to ensure the stability of sending or receiving signals of the chip of the optical device, a thermoelectric cooler (TEC, Thermoelectric Cooler) is usually used to precisely control the temperature of the chip, for example, the temperature of the chip is controlled at 45±0.1°C. [0003] With the development of optical devices in the direction of low cost and high performance, thermoelectric coolers are also facing the requirements of low cost and high performance. A thermoelectric cooler usually includes two opposite substrates, between which there are P-type semiconductor thermo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L35/02H01L35/32H01L35/34
CPCH10N10/80H10N10/01H10N10/17H10N10/817
Inventor 杨成鹏朱宁军郭庭辉
Owner HUAWEI TECH CO LTD
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