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Circuit board with metallic half -holes and its production method

A technology of metallizing half-holes and manufacturing methods, which is applied in the directions of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems of reducing product yield and short circuit of copper wires, and achieves the effect of increasing cost and preventing peeling.

Active Publication Date: 2022-08-09
QING DING PRECISION ELECTRONICS HUAIAN CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Later, when the PCB semi-hole board is connected to the mother board, the copper wire will cause a short circuit problem and reduce the product yield

Method used

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  • Circuit board with metallic half -holes and its production method
  • Circuit board with metallic half -holes and its production method
  • Circuit board with metallic half -holes and its production method

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Embodiment Construction

[0052] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0054] A preferred embodiment of the present invention provide...

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PUM

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Abstract

A manufacturing method of a circuit board with metallized half-holes, comprising: providing a copper clad plate and opening at least one first through hole. A conductive film is formed in the first through hole. At least one second through hole is opened in the copper clad laminate, and the second through hole partially overlaps with the first through hole with the conductive film to form an overlapping area. Electroplating to form an electroplating layer on the conductive film, thereby forming metallized holes, the hole wall of each metallized hole and the corresponding second through hole intersect at two connection points, and the connection of the connection points divides the copper clad laminate is the product area including the metallized holes and the waste area including the second through holes. The part of the waste area away from the product area is cut to obtain the metallized half-hole and the escape area outside the metallized half-hole. The manufacturing method provided by the present invention can prevent the electroplating layer from peeling off the base material, and can effectively prevent the copper wire from being generated in the first through hole. In addition, the present invention also provides a circuit board with a metallized half hole.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a circuit board with metallized half-holes and a manufacturing method thereof. Background technique [0002] With the development of diversification, high density and miniaturization of printed circuit boards (PCBs), metallized half holes are usually provided at the edge of the board. When the metallized hole is cut in this manufacturing method, copper wires (burrs) may be formed in the hole and on the surface of the hole. Subsequently, when the PCB half-hole board is connected to the motherboard, the copper wire will cause a short circuit problem and reduce the product yield. SUMMARY OF THE INVENTION [0003] In view of this, the present invention provides a circuit board with metallized half-holes that can avoid the generation of copper wires and a manufacturing method thereof, thereby improving the yield of the circuit board. [0004] A method for manuf...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K3/42
CPCH05K1/115H05K1/117H05K3/42H05K2203/308
Inventor 朱贤江李卫祥
Owner QING DING PRECISION ELECTRONICS HUAIAN CO LTD
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