Warming-up method for semiconductor technology equipment and semiconductor technology equipment

Abstract

The invention provides a warming-up method for semiconductor technology equipment and the semiconductor technology equipment. The method comprises the steps of: determining an identifier of a warming-up wafer box loaded on the semiconductor technology equipment and the distribution information of warming-up wafers in the warming-up wafer box, and transmitting the identifier and the distribution information to a control end to enable the control end to verify the identifier and the distribution information in sequence; and after the identifier and the distribution information passes verification, executing a circulating warming-up process on at least part of the warming-up wafers according to a circulating process instruction sent by the control end. By applying the method, the overall operation time and the production operation cost of the circulating heating process can be reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a warm-up method for semiconductor process equipment and the semiconductor process equipment. Background technique [0002] In the daily production of wafers, the control terminal equipment of the factory generally interacts with the semiconductor process equipment in accordance with the message format defined by the SEMI standard, and sends instructions to the semiconductor process equipment. The semiconductor process equipment specifies the carrier (wafer box), Wafer (wafer) and recipe (process formula) are used to carry out specific automatic operation processes, so as to transfer the wafer (wafer) to the designated chamber for process processing. Generally, after the wafer box (Foup) is delivered to the machine, the semiconductor process equipment will automatically operate according to the sequence of loading, process, and unloading. [0003] After the p...

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Problems solved by technology

[0004] However, in the recovery process after the regular maintenance of the existing process chamber, in order to reach the preset number of warm-up processes, either a sufficient amount of warm-up wafers are placed in the wafer cassette, and the warm-up is completed through a warm-up process task. In this way, each warm-up chip is only processed once, which makes the warm-up cost higher, or an insufficient amount of warm-up chips are placed in the wafer box, and the warm-up is completed through multiple warm-up process tasks. This method requires multiple loading - In the process of operation-unloading, the recovery period of the chamber is longer, which wastes labor costs to a certain extent

Existing warm-up methods cannot meet the requirements of rapid recovery chamber while reducing costs

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