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Vapor chamber

A vapor chamber and sheet technology, applied in indirect heat exchangers, heat exchange equipment, lighting and heating equipment, etc., can solve problems such as thermal design difficulties, insufficient heat transfer of graphite sheets, etc., to prevent drying out Effect

Pending Publication Date: 2021-07-23
开尔文热技术股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This situation is more pronounced in mobile terminals (e.g., mobile smartphones or tablet devices), and thermal design has become extremely difficult
Although a graphite sheet or the like is used as a member for coping with heat, the heat transfer amount of the graphite sheet or the like is not sufficient

Method used

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Examples

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Embodiment Construction

[0035] In some embodiments, a vapor chamber (or thermal ground plane) is disclosed. However, various embodiments are not limited to various configurations described in this document, and various embodiments or inventions can be applied with appropriate modifications within a range in which the gist of the disclosed embodiments of the present invention does not change. Furthermore, an embodiment or configuration obtained by combining two or more examples, embodiments, or configurations described in this document also falls within the scope of the present invention.

[0036] The various embodiments described in this document are provided as example embodiments only. The respective embodiments and configurations of the embodiments described in different embodiments may be partially replaced or combined with each other.

[0037] A vapor chamber according to the present invention is a vapor chamber comprising: a casing formed of a first sheet and a second sheet facing each other a...

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Abstract

Disclosed is a vapor chamber having excellent function of circulating a working liquid from an end portion to a center portion of a wick and enabling the prevention of the occurrence of dry-out. The vapor chamber includes a casing formed of a first sheet and a second sheet which face each other and whose outer peripheries are bonded to each other; a working liquid sealed in the casing; and a wick disposed on an inner wall surface of the first sheet or the second sheet. A wall portion is disposed around the wick as viewed in a top plan view of an inside of the casing.

Description

technical field [0001] This disclosure generally relates to thermal ground planes. Background technique [0002] Recently, with the realization of higher integration and higher performance of electronic equipment, the heating value has increased. In addition, as products are miniaturized, heat generation density increases, and thus measures for dealing with radiation of heat become important. This situation is more pronounced in mobile terminals (eg, mobile smartphones or tablet devices), and thermal design has become extremely difficult. Although a graphite sheet or the like is used as a member for coping with heat, the heat transfer amount of the graphite sheet or the like is not sufficient. [0003] Vapor chamber (chamber or steam chamber) is a component with high heat transfer capacity for dealing with heat, and the vapor chamber is a planar heat pipe. The vapor chamber exhibits an overall excellent apparent thermal conductivity (apparent thermal conductivity), which ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/02F28F3/02
CPCF28D15/046G06F1/203F28D15/0233F28F2225/04F28F2240/00B23P15/26
Inventor 里安·J·路易斯若冈琢雄小岛高桥
Owner 开尔文热技术股份有限公司
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