Semiconductor assembly with discrete energy storage component
An energy storage and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, fixed capacitor components, etc., can solve problems such as high cost and inability to develop, achieve long life time, easy design, and improve life cycle Effect
Inactive Publication Date: 2021-07-23
SMOLTEK AB
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Problems solved by technology
[0010] Discrete capacitor parts need to be produced in the trillions to meet industrial demands, and CMOS compatible technologies are too costly to develop for the production of discrete parts for MLCCs or LICCs or TSCs
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[0041] In this detailed description, example embodiments of semiconductor components according to the present invention are primarily described as comprising semiconductor die flip-chip connected to each other and discrete capacitor components connected to pads of the semiconductor component. It should be noted that many other configurations are within the scope defined by the claims. For example, many other ways of interconnecting semiconductor die are envisioned, including wire bonding, direct die bonding, and the like. Additionally, one or several capacitors may be formed directly on one or more semiconductor dies. According to the invention it is also contemplated to stack more than one capacitor on top of each other to form a stack of capacitors.
[0042] According to an embodiment, the energy storage device may be provided in the form of a nanostructured electrochemical memory or battery. In these embodiments, the conduction control material primarily includes ions as ...
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A semiconductor assembly, comprising: a first semiconductor die including processing circuitry and pads, the first semiconductor die having a first surface and a second surface opposite the first surface; a second semiconductor die including memory circuitry and pads, the second semiconductor die being arranged on one of the first surface and the second surface of the first semiconductor die, and pads of the second semiconductor die being coupled to pads of the first semiconductor die; and at least a first capacitor having terminals, the first capacitor being arranged on one of the first surface and the second surface of the first semiconductor die and the terminals of the capacitor being coupled to pads of the first semiconductor die.
Description
technical field [0001] The present invention relates to semiconductor components, and to electronic components comprising such semiconductor components. Background technique [0002] The miniaturization of electronic devices has been trending for decades, which has allowed us to witness different kinds of appliances with many functions. In large part, this advancement has been achieved by miniaturizing and integrating transistors, resistors and capacitors for logic applications onto silicon. By comparison, passive components (resistors, capacitors, and inductors) at the board level have made only incremental advances in size and density. Consequently, passive components occupy an increasing area and mass fraction of electronic systems and are a major obstacle to further miniaturization of many electronic systems at lower system cost. Current smartphones typically use more than 1000 discrete capacitor components. Circuit boards for EVs use about 10,000 of these discrete ca...
Claims
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IPC IPC(8): H01G4/008H01G4/06H01L23/498H01L23/538H01L23/64H01L27/02H05K1/18B82B1/00B82Y40/00H01L25/11
CPCH01G4/008H01G4/06H01L23/49816H01L23/5385H01L23/50H01L23/49822H01L28/90B82Y30/00H01L2224/73201H01L2224/16227H01L24/08H01L23/642H01L25/105H01L25/0657H01L2225/1058H01L2225/0651H01L2225/06568H01L2224/1134H01L2224/13147H01L2224/29339H01L2224/08145H01L2224/08H01L2224/16H01L2924/00014H01L2224/08147H01L28/60H01L2225/06582H01L2225/1035H01L2924/19041H01L2924/19104
Inventor M·沙菲克·卡比尔文森特·德马里斯里卡德·安德森穆罕默德·阿明·萨利姆玛丽亚·比隆德安德斯·约翰逊弗雷德里克·利尔耶贝格奥拉·特维曼
Owner SMOLTEK AB