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Production line, apparatus and method for transferring semiconductor wafers

A production line and semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, conveyor objects, etc., can solve problems such as a lot of time and manpower, wrong handling of chips by users, damage, etc.

Pending Publication Date: 2021-07-27
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This requires a lot of time and manpower
Furthermore, wafers are not protected by the cassette housing and are inevitably exposed to air during manual transfer
In this case, the wafer may be contaminated, damaged, or otherwise discarded due to user mishandling of the wafer

Method used

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  • Production line, apparatus and method for transferring semiconductor wafers
  • Production line, apparatus and method for transferring semiconductor wafers
  • Production line, apparatus and method for transferring semiconductor wafers

Examples

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Embodiment Construction

[0015] The following disclosure provides many different embodiments, or examples, for implementing different features of the presented subject matter. Specific examples of components and arrangements are set forth below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description, forming a first feature on or over a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which the first feature is formed in direct contact with the second feature. Embodiments in which additional features may be formed between a feature and a second feature such that the first and second features may not be in direct contact. Additionally, this disclosure may reuse reference numbers and / or letters in various instances. Such re-use is for brevity and clarity and does not in itself indicate a relationship between the var...

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PUM

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Abstract

An illustrative embodiment disclosed herein is an apparatus that includes a first carrier tray configured to be coupled to a first wafer support device that supports a plurality of wafers. The first wafer support device includes a first opening. The apparatus includes a second carrier tray configured to be coupled to a second wafer support device. The second wafer support device includes a second opening. The apparatus includes a first motor coupled to the first carrier tray and configured to rotate the first wafer support device until the first opening faces the second opening to allow the plurality of wafers to be transferred from the first wafer support device to the second wafer support device.

Description

technical field [0001] The present application relates to a method and apparatus for semiconductor wafer transfer, and more particularly, to a method for transfer between a first wafer holding device and a second wafer holding device. A method and device for transferring semiconductor wafers. Background technique [0002] Traditionally, to transfer wafers from a first pod or cassette to a second pod or cassette, a user would transfer wafers one by one. This requires a lot of time and manpower. Furthermore, the wafers are not protected by the cassette housing and are inevitably exposed to air during manual transfer. In such cases, the wafer may become contaminated, damaged, or otherwise discarded due to user mishandling of the wafer. Contents of the invention [0003] An embodiment of the present invention provides a production line (process line) for transferring semiconductor wafers, including a first wafer processing station (first wafer processing station); a second ...

Claims

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Application Information

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IPC IPC(8): H01L21/677
CPCH01L21/67703H01L21/67763H01L21/67775H01L21/67781B65G47/90H01L21/67265H01L21/67718H01L21/6773
Inventor 杨中雄陈永和
Owner TAIWAN SEMICON MFG CO LTD