Test device with temperature control unit and test classification equipment applying test device

Abstract

The invention discloses a test device with a temperature control unit and test classification equipment applying the test device with the temperature control unit. According to the test device with the temperature control unit, the temperature control unit preheats a first batch of electronic components through a first temperature generator and preheats a circuit board through a second temperature generator; in addition, the temperature control unit is provided with a first sensor at a crimping device to sense the surface temperature of the electronic components, and senses the temperature of the circuit board through a second sensor, and the first sensor and the second sensor transmit surface temperature sensing data of the electronic components and temperature sensing data of the circuit board to a processor; and the processor analyzes the surface temperature sensing data of the electronic components and the temperature sensing data of the circuit board with reference to a database, so that whether the internal temperature of the electronic components reaches a preset test temperature or not can be known, test operation on the first batch of electronic components can be quickly carried out, and the test accuracy and the test productivity of the first batch of electronic components are effectively improved.

Description

technical field [0001] The present invention provides a test device with a temperature control unit capable of knowing that the internal temperature of the first batch of electronic components has reached a preset test temperature and performing a test operation, so as to effectively improve the test accuracy and test throughput of the first batch of electronic components . Background technique [0002] Electronic components are used in high-temperature operating environments or low-temperature operating environments. When performing test operations, the test classification equipment must make electronic components perform tests in the preset test temperature range that simulates the actual operating environment; therefore, the test classification equipment is equipped with a temperature control device. Make electronic components perform hot test or cold test in the preset test temperature range. However, electronic components are divided into internal temperature (Tj) and ...

AI Technical Summary

Problems solved by technology

[0004] However, as mentioned above, the testing machine 27 of the packaging and testing company is not open to provide the internal temperature (Tj) of the electronic component 10, and the test classification equipment made by the equipment manufacturer can only read the surface temperature of the electronic component 10 through the temperature sensor 24 ( Tc), and use work experience to estimate that the internal temperature (Tj) of the electronic component 10 may reach the preset test temperature range; this method often causes false detections in the first batch of electronic component 10 testing operations, such as predicting Assuming that the test temperature range is 130±10°C, although the cooling chip 22 can heat the surface temperature (Tc) of the electronic component 10 within the temperature range of 130±10°C, because the testing machine 27 is in the initial test, its own The temperature is only about 15-25°C, causing the internal temperature (Tj) of the first batch of electronic components 10 to pass through the circuit board 25 and the test socket 26 to conduct heat to the testing machine 27 in large quantities, so that the inside of the electronic component 10 The temperature (Tj) is lower than the preset test temperature range of 130±10°C, causing the testing machine 27 to misjudge the first batch of electronic components 10 as defective products, but in fact the first batch of electronic components 10 are not really defective. Qualified products are just that the internal temperature (Tj) is lower than the preset test temperature range due to heat conduction to the tester 27, and this kind of mistesting must be done until the tester 27 is heated to a certain extent by heat conduction. The heat conduction of the follow-up electronic components 10 is reduced, and the internal temperature (Tj) of the follow-up electronic components 10 will approach the surface temperature (Tc) to be improved. Generally speaking, after about 3 or 4 first batches of electronic components After the test of 10, the situation of this false detection can be improved, because the first 3,4 electronic components 10 of the first batch are not really unqualified products, so the staff must once again put the first 3,4 electronic components A batch of electronic components 10 is retested, which affects the test capacity of the test sorter

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