Finishing head rotating part, polishing pad finishing head and finisher

A head rotation, polishing pad technology, applied to the components of grinding machine tools, grinding/polishing equipment, abrasive surface conditioning devices, etc.
CN113183031APending Publication Date: 2021-07-30HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD
Publication Date
2021-07-30

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Abstract

The invention discloses a dressing head rotating part, a polishing pad finishing head and a finisher. An inner ring lower pressing cover is arranged in a cavity formed between a transmission film and a grinding base, and an universal transmission pin is arranged between the inner ring lower pressing cover and the grinding base, so that a transmission film transmission structure is formed, due to the transformable characteristic of the transmission film, after a grinding wheel plate arranged below the grinding base makes contact with a polishing pad, certain pressure is applied downwards to the dressing head rotating part, the transmission film deforms with the universal transmission pin as an adjusting fulcrum along with the attachment of the grinding wheel plate to the polishing pad, and therefore universal adjustment is achieved, the grinding wheel plate is closely attached to the polishing pad, and the polishing effect of the dressing head on the polishing pad is guaranteed.
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Description

technical field

[0001] The invention relates to the field of semiconductor integrated circuit chip manufacturing, in particular to a dressing head rotating part, a polishing pad dressing head and a dresser. Background technique

[0002] In the Chemical Mechanical Planarization (CMP) equipment, the wafer is polished on the surface of the rough polishing pad. As the polishing time prolongs, the surface of the polishing pad is ground and the polishing effect is lost. The dresser of the grinding wheel trims the surface of the polishing pad to make the surface of the polishing pad rough and frictional, so that it can continue to have the function of polishing. However, as the polishing pad is used for a long time, the thickness of the polishing pad will decrease and the surface height will be uneven. The problem of losing the polishing effect is that if the grinding wheel disc cannot fit tightly with the polishing pad, the edge of the grinding wheel disc will cause scratches on t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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