Finishing head rotating part, polishing pad finishing head and finisher
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD
- Publication Date
- 2021-07-30
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Abstract
Description
technical field
[0001] The invention relates to the field of semiconductor integrated circuit chip manufacturing, in particular to a dressing head rotating part, a polishing pad dressing head and a dresser. Background technique
[0002] In the Chemical Mechanical Planarization (CMP) equipment, the wafer is polished on the surface of the rough polishing pad. As the polishing time prolongs, the surface of the polishing pad is ground and the polishing effect is lost. The dresser of the grinding wheel trims the surface of the polishing pad to make the surface of the polishing pad rough and frictional, so that it can continue to have the function of polishing. However, as the polishing pad is used for a long time, the thickness of the polishing pad will decrease and the surface height will be uneven. The problem of losing the polishing effect is that if the grinding wheel disc cannot fit tightly with the polishing pad, the edge of the grinding wheel disc will cause scratches on t...