Finishing head rotating part, polishing pad finishing head and finisher

A head rotation, polishing pad technology, applied to the components of grinding machine tools, grinding/polishing equipment, abrasive surface conditioning devices, etc.

Pending Publication Date: 2021-07-30
HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the embodiment of the present invention provides a dressing head rotating part, a polishing

Method used

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  • Finishing head rotating part, polishing pad finishing head and finisher
  • Finishing head rotating part, polishing pad finishing head and finisher
  • Finishing head rotating part, polishing pad finishing head and finisher

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Embodiment Construction

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0042] In this application, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes none. other elements specifically listed, or also include elements inherent in such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "com...

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PUM

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Abstract

The invention discloses a dressing head rotating part, a polishing pad finishing head and a finisher. An inner ring lower pressing cover is arranged in a cavity formed between a transmission film and a grinding base, and an universal transmission pin is arranged between the inner ring lower pressing cover and the grinding base, so that a transmission film transmission structure is formed, due to the transformable characteristic of the transmission film, after a grinding wheel plate arranged below the grinding base makes contact with a polishing pad, certain pressure is applied downwards to the dressing head rotating part, the transmission film deforms with the universal transmission pin as an adjusting fulcrum along with the attachment of the grinding wheel plate to the polishing pad, and therefore universal adjustment is achieved, the grinding wheel plate is closely attached to the polishing pad, and the polishing effect of the dressing head on the polishing pad is guaranteed.

Description

technical field [0001] The invention relates to the field of semiconductor integrated circuit chip manufacturing, in particular to a dressing head rotating part, a polishing pad dressing head and a dresser. Background technique [0002] In the Chemical Mechanical Planarization (CMP) equipment, the wafer is polished on the surface of the rough polishing pad. As the polishing time prolongs, the surface of the polishing pad is ground and the polishing effect is lost. The dresser of the grinding wheel trims the surface of the polishing pad to make the surface of the polishing pad rough and frictional, so that it can continue to have the function of polishing. However, as the polishing pad is used for a long time, the thickness of the polishing pad will decrease and the surface height will be uneven. The problem of losing the polishing effect is that if the grinding wheel disc cannot fit tightly with the polishing pad, the edge of the grinding wheel disc will cause scratches on t...

Claims

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Application Information

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IPC IPC(8): B24B53/017B24B53/12
CPCB24B53/017B24B53/12
Inventor 周智鹏张志军
Owner HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD
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