Silica sol with convex colloid surface, preparation method and application of silica sol

A technology of silica sol and colloid, which is applied in the direction of chemical instruments and methods, silicon compounds, polishing compositions containing abrasives, etc., can solve the problem that it is difficult to obtain silica sol and silica gel with protrusions on the surface of silica colloid particles. The problem of low surface roughness of bulk particles can be solved to achieve the effects of reducing defects and scratches, high hardness and improving grinding efficiency

Active Publication Date: 2021-02-02
河北硅研电子材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the low surface roughness of silica colloidal particles in silica sol existing in the prior art, it is difficult to obtain silica sol with non-spherical silica colloidal particles and convex shapes on the surface, etc., the present invention provides a colloidal surface with a Protruding silica sol and its preparation method and application

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  • Silica sol with convex colloid surface, preparation method and application of silica sol
  • Silica sol with convex colloid surface, preparation method and application of silica sol
  • Silica sol with convex colloid surface, preparation method and application of silica sol

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Embodiment 1

[0053] A kind of silica sol whose colloidal surface is convex, including liquid medium water and colloidal particles, said colloidal particles are mace-shaped silica colloidal particles with raised surfaces, and the height H of said protrusions is 5.1 nm; the fitted particle diameter of the nitrogen adsorption BET specific surface area of ​​the silica colloidal particles is D 1 , the short-axis particle diameter obtained by TEM characterization is D 2 , the particle size measured by dynamic light scattering is D 3 ,D 2 / D 1 is 1.73, and D 3 / D 1 is 3.38.

[0054] The above-mentioned colloidal surface is the preparation method of convex silica sol, specifically comprises the following steps:

[0055] Add 3.4kg of tetramethoxysilane dropwise to a mixed solution containing 10.1kg of ultrapure water and 1.9g of 3-ethoxypropylamine at 80°C and react for 1 hour to obtain a silica sol seed liquid with a pH of 6.26. Among them, the primary particle size of the seed particles is...

Embodiment 2

[0058] A kind of silica sol with convex colloidal surface, including liquid medium water and colloidal particles, the colloidal particles are mace-shaped silica colloidal particles with convex surfaces, and the height H of the convexities is 5.2 nm; the fitted particle diameter of the nitrogen adsorption BET specific surface area of ​​the silica colloidal particles is D 1 , the short-axis particle diameter obtained by TEM characterization is D 2 , the particle size measured by dynamic light scattering is D 3 , 1.2≤D 2 / D 1 is 1.71, and D 3 / D 1 is 3.59.

[0059] The above-mentioned colloidal surface is the preparation method of convex silica sol, specifically comprises the following steps:

[0060] Add 3.4kg of tetramethoxysilane dropwise to a mixed solution containing 10.1kg of ultrapure water and 1.9g of 3-ethoxypropylamine at 80°C and react for 1 hour to obtain a silica sol seed liquid with a pH of 6.26. Among them, the primary particle size of the seed crystal parti...

Embodiment 3

[0063] A kind of silica sol with convex colloidal surface, including liquid medium water and colloidal particles, the colloidal particles are mace-shaped silica colloidal particles with convex surfaces, and the height H of the convexities is 5.4 nm; the fitted particle diameter of the nitrogen adsorption BET specific surface area of ​​the silica colloidal particles is D 1 , the short-axis particle diameter obtained by TEM characterization is D 2 , the particle size measured by dynamic light scattering is D 3 ,D 2 / D 1 is 1.72, and D 3 / D 1 is 4.01.

[0064] The above-mentioned colloidal surface is the preparation method of convex silica sol, specifically comprises the following steps:

[0065] Add 3.4kg of tetramethoxysilane dropwise to a mixed solution containing 10.1kg of ultrapure water and 1.9g of 3-ethoxypropylamine at 80°C and react for 1 hour to obtain a silica sol seed liquid with a pH of 6.26. Among them, the primary particle size of the seed crystal particles ...

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Abstract

The invention relates to the technical field of chemical mechanical polishing of semiconductors, and particularly discloses silica sol with a convex colloid surface, a preparation method and application of the silica sol. The silica sol with a convex colloid surface comprises a liquid medium and colloidal particles, the colloidal particles are wolf-tooth-stick-shaped silicon dioxide colloidal particles with bulges on the surface, and the heights H of the bulges are 1-8nm; the nitrogen adsorption BET specific surface area fitting particle size of the silicon dioxide colloid particles is D1, theshort-axis particle size obtained through characterization of a transmission electron microscope is D2, the particle size measured through dynamic light scattering is D3, D2 / D1 is larger than or equal to 1.2 and smaller than or equal to 1.8, and D3 / D1 is larger than or equal to 2.0 and smaller than or equal to 6.3. The silica sol provided by the invention has high roughness and special-shaped degree, can effectively reduce the contact time with a ground object and reduce the generation of defects and scratches, and is beneficial to improving the polishing efficiency when being used in a polishing solution.

Description

technical field [0001] The invention relates to the technical field of semiconductor chemical mechanical polishing, in particular to a silica sol with a convex colloidal surface and a preparation method and application thereof. Background technique [0002] Silica sol is a dispersion of nano-sized silica particles in water or a solvent. Silica sol is a colloidal solution, which is odorless and non-toxic. It can be used in casting, coating, papermaking and other fields, and can also be used as an abrasive in semiconductor CMP polishing fluid. The silica particles used in the semiconductor CMP polishing fluid need to have high purity and density, a certain length-to-diameter ratio, and stability under certain acid-base conditions. In particular, when the silica particles have a convex surface, that is, have a certain surface roughness, the silica sol can achieve higher polishing efficiency. [0003] At present, the method for preparing high-purity silica colloidal particles ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B33/141B82Y40/00C09G1/02
CPCC01B33/141B82Y40/00C09G1/02C01P2004/16C01P2006/40C01P2004/04C01P2004/64C01P2006/10C01P2006/12C01P2004/62
Inventor 朱斌仵靖赵丽晓
Owner 河北硅研电子材料有限公司
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