Impedance line manufacturing method, impedance line and circuit board

Abstract

The invention relates to an impedance line manufacturing method, an impedance line and a circuit board. The impedance line manufacturing method comprises the steps of: manufacturing a first impedance line and a second impedance line on a first conductive layer and a second conductive layer respectively; designing bonding pads at the tail ends of the first impedance line and the second impedance line; performing pressing and manufacturing blind holes at corresponding positions of the bonding pads, and removing media on the bonding pads; carrying out adhesive residue removal, cleaning and drying treatment; and carrying out electroplating treatment, so as to fill the blind holes with metal copper to obtain metal blind holes. According to the manufacturing method of the impedance line, the structure of the circuit board is changed, the impedance line is moved into the inner layer, and the blind holes are manufactured, and electroplating is performed, so that the impedance line on the inner layer can extend to the outer layer through the blind holes to form a contact point, and therefore, impedance measurement is facilitated. In the whole process, the manufactures are few, the technology is simple, the impedance line can be effectively prevented from being interfered by the external environment due to the protection effect of a dielectric layer on the inner layer impedance line, and the impedance stability can be kept in the testing and using process of the circuit board.

Description

technical field [0001] The present application relates to the technical field of printed circuit board processing, in particular to a manufacturing method of impedance lines, impedance lines and circuit boards. Background technique [0002] Printed Circuit Board (PCB), referred to as circuit board, is made by electronic printing technology. The circuit board is not only a carrier that provides circuits, but also a carrier that provides electrical signals. Some circuit boards in the communication, medical, and industrial control industries have certain requirements for impedance, and impedance lines need to be made for subsequent impedance testing. [0003] The copper thickness of the impedance line has a direct impact on the impedance value. The traditional manufacturing method of impedance lines adopts the selective electroplating method of partial protective replating for the production of impedance lines. It needs to go through the process of making dry film, exposing, ...

AI Technical Summary

Problems solved by technology

The traditional manufacturing method of impedance line adopts the selective electroplating method of partial protective replating to make impedance line. It needs to go through the process of making dry film, exposure, development, film fading and so on. The process is complicated, the materials are used too much, and the cost increases

And due to the use of selective plating, it is easy to cause the thickness of the impedance line copper to be thinner than other lines, that is, the position of the impedance line has a depression

In the subsequent production of solder mask or cover film, it is easy to cause the thickness of the solder mask to be too large or the cover film is not firmly attached, which affects the process quality of the circuit board and also affects the impedance performance of the circuit board

[0004] Therefore, the traditional gold finger manufacturing method has the problems of complex process and poor impedance performance.

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