Packaged antenna module, manufacturing method of packaging antenna module and terminal equipment
An antenna module, built-in antenna technology, applied in the direction of antenna support/installation device, antenna, antenna parts, etc., can solve the problem of different structure of packaged antenna molds
Active Publication Date: 2021-08-06
HUAWEI TECH CO LTD +1
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0004] An object of this application is to provide a packaged antenna module, which aims to solve the problem of manufacturing different packages when the positions of the connectors connected to other modules on the packaged antenna are different. The problem of the mold structure of the antenna is different
Method used
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[0062] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.
[0063] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0064] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations or posi...
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The invention discloses a packaged antenna module, and belongs to the field of antennas. The antenna comprises a substrate, a radio frequency chip, a built-in antenna, a plastic package structure and a connecting conductor. The substrate is provided with a conductive circuit, and the conductive circuit can be used for being electrically connected with a mainboard of the terminal equipment. The radio frequency chip is used for generating a radio frequency signal and transmitting the radio frequency signal outwards through the built-in antenna, and is used for processing an electromagnetic wave signal received by the built-in antenna. The built-in antenna is electrically connected with the radio frequency chip so as to realize signal mutual transmission between the built-in antenna and the radio frequency chip. The plastic package structure is used for covering the radio frequency chip and the built-in antenna on the substrate. As the plastic package structure covers the surface of the substrate, when a plastic package material covers the substrate by using a plastic package mold, a corresponding structure making the local part of the substrate not covered by the plastic package material is not required to be arranged, and therefore, under the condition that the positions of the connecting conductor are different, different plastic package molds do not need to be provided, and one plastic package mold can be shared.
Description
technical field [0001] The present application relates to the field of antenna technology, and in particular to a packaged antenna module, a manufacturing method of the packaged antenna module, and a terminal device. Background technique [0002] The antenna in package (AiP, Antenna in Package) module plastic-seals the antenna and radio frequency components on the substrate, which has a high degree of integration. When the packaged antenna is applied to a terminal device with communication functions, the packaged antenna is electrically connected to the main board of the terminal device. Due to the limited area of the main board, there are fewer electrical connection points, so the packaged antenna can be provided with connectors connected to other external modules. , so as to realize that other modules are electrically connected to the main board through the package antenna, and can also be directly electrically connected to the package antenna. [0003] In the method of...
Claims
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IPC IPC(8): H01Q1/22H01Q1/50H01L21/56H01L23/66
CPCH01Q1/2283H01Q1/50H01L23/66H01L21/56H01L2223/6677
Inventor 于睿张湘辉吴政达林正忠
Owner HUAWEI TECH CO LTD