Automatic glue extruding device for circuit board assembling

Abstract

The invention relates to the technical field of heat-conducting glue, and discloses an automatic glue extruding device for circuit board assembling. The automatic glue extruding device comprises a housing, wherein the exterior of the housing is fixedly connected with a button, a view opening is formed in the surface of the housing, and the interior of the housing is movably connected with a rotating wheel; a sliding groove is formed in the surface of the rotating wheel, and the inner side of the sliding groove is connected with a roller in a sliding manner. Under the interaction of the view opening, the rotating wheel, the sliding groove, the roller, a first connecting rod, a second connecting rod, a sliding rail, a sliding plate, a detection rod, a support plate, fixing shells, magnetic rings, electromagnets, a rotating plate, telescopic rods, snap rings, movable balls, mounting plates, adjusting plates, photosensitive assemblies, a detection assembly and a delay assembly, the operation of using the heat-conducting glue in the circuit board mounting process can be simpler, and meanwhile, the circuit board mounting operation is more time-saving and labor-saving, so that the circuit board mounting efficiency and quality are improved, the quality stability of the circuit board is improved, and the economic benefits of enterprises are increased.

Description

technical field [0001] The invention relates to the technical field of heat-conducting adhesive, in particular to an automatic extruding device for circuit board assembly. Background technique [0002] Thermally conductive adhesive is a one-component, thermally conductive, room temperature curing silicone adhesive sealant, which releases low molecules through the condensation reaction of moisture in the air to cause crosslinking and curing, and vulcanizes into a high-performance elastomer. Good viscous thermal conductive adhesive has excellent resistance to alternating cold and heat, aging resistance and electrical insulation performance, and has excellent moisture resistance, shock resistance, corona resistance, leakage resistance and chemical medium resistance, and can be used continuously at -60~ 280°C and maintain performance, no swelling and good adhesion to most metal and non-metal materials, so thermally conductive adhesives are widely used in the installation of elec...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an automatic extrusion device for circuit board assembly, which has the advantages of automatic extrusion, intelligent quantitative, simple operation, time-saving and labor-saving, high efficiency, and strong practicality, and solves the problem of existing problems. The process of using thermal conductive adhesive can only be manually extruded and applied on the surface of the circuit board. Since manual extrusion of the thermal adhesive cannot quantitatively control the extrusion amount of the thermal conductive adhesive, it will not only make the quality of the circuit board installation difficult to control, but also It can also cause waste of thermal conductive adhesive. Manual extrusion of adhesive will bring a large workload to the operator, and will also reduce the efficiency and quality of circuit board installation, thereby reducing the practicability of thermal conductive adhesive.

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