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Laser weakening procedure mistake-proof shearing device and instrument board weakening machining device

A technology of shearing device and processing device, which is applied in the direction of shearing device, metal processing equipment, shearing machine equipment, etc., can solve the problems of unfavorable quality control, it is difficult to intuitively find product weakening, increase laser workload and man-hours, etc., to achieve The effect of quality monitoring

Pending Publication Date: 2021-08-13
DONGFENG VISTEON AUTOMOTIVE TRIM SYST CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The embodiment of the present invention provides a laser weakening process error-proof shearing device and an instrument panel weakening processing device to solve the problem that after the existing weakening is completed and detected as a qualified product, the actual product does not have any marks or changes, which is difficult to identify and is detected as incorrect. After qualified products, laser weakening of the round hole mark is required, which increases the laser workload and man-hours, increases loss and environmental pollution. In fact, it is difficult to intuitively find out whether the product has been weakened. There is no obvious mark, which is not conducive to technical problems of quality control.

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  • Laser weakening procedure mistake-proof shearing device and instrument board weakening machining device
  • Laser weakening procedure mistake-proof shearing device and instrument board weakening machining device
  • Laser weakening procedure mistake-proof shearing device and instrument board weakening machining device

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Embodiment Construction

[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] The embodiment of the present invention provides a laser weakening process error-proof shearing device and an instrument panel weakening processing device, which can solve the problem that after the existing weakening is completed and detected as a qualified product, there is no mark or change on the actual product, which is difficult t...

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Abstract

The invention relates to the technical field of instrument board product machining, and provides a laser weakening procedure mistake-proof shearing device and an instrument board weakening machining device. The laser weakening procedure mistake-proof shearing device comprises a fixing mechanism, a movable driving mechanism and a shearing mechanism; the fixing mechanism comprises a fixing plate, and the fixing plate is used for being fixed to a laser weakening device; the movable driving mechanism comprises movable driving air cylinders fixed to the fixing plate; and the shearing mechanism comprises a pneumatic scissor structure, and the pneumatic scissor structure is in transmission connection with the movable driving air cylinders. According to the laser weakening procedure mistake-proof shearing device provided by the invention, the shearing mechanism and the movable driving mechanism are arranged, the shearing mechanism is driven to shear mistake-proof ribs of instrument board products, visual recognition of the instrument board products which are qualified in weakening is achieved, and quality monitoring of the instrument board products is achieved.

Description

technical field [0001] The invention relates to the field of assembly detection, in particular to a laser weakening process error-proof shearing device and an instrument panel weakening processing device. Background technique [0002] In the prior art, after the laser weakening procedure is completed and the product weakening result is confirmed by laser inspection, the product will be returned directly to the storage area if it passes the test. Refers to the laser cutting of a circular hole in the area to destroy it so as not to flow into the next process. [0003] After weakening the existing technology, there are the following defects: [0004] 1. After testing as a qualified product, there is no mark or change on the actual product, which is difficult to identify; [0005] 2. After the product is detected as unqualified, the laser needs to weaken the round hole mark, which will increase the laser workload and man-hours, increase loss and environmental pollution; [00...

Claims

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Application Information

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IPC IPC(8): B23P23/04B23D17/00
CPCB23P23/04B23D17/00
Inventor 孙珍金林杰曹俊杰胡蔚赵磊吴亮佘启峰陈品峰李良力吴俊磊陈刚倪海飞史勇刘江红
Owner DONGFENG VISTEON AUTOMOTIVE TRIM SYST CO LTD