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Infrared detector low-heat-leakage packaging device, preparation method thereof and infrared detector

An infrared detector and packaging device technology, applied in the computer field, can solve the problems of inability to realize, low working temperature and the like

Active Publication Date: 2021-08-17
11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention provides a low-temperature infrared detector low-leak heat packaging device and its preparation method and infrared detector to solve the problem that existing infrared focal plane detectors cannot realize The problem with lower operating temperatures

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  • Infrared detector low-heat-leakage packaging device, preparation method thereof and infrared detector
  • Infrared detector low-heat-leakage packaging device, preparation method thereof and infrared detector
  • Infrared detector low-heat-leakage packaging device, preparation method thereof and infrared detector

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Embodiment Construction

[0031] The embodiment of the present invention aims at the problem that the existing infrared detector cannot be applied to a lower operating temperature (such as 20K) and a longer operating wavelength (very long wave), by setting a Dewar on the cold head part of the Dewar cold finger cold screen, and a cold screen heat shield is provided outside the Dewar cold screen and the cold head part, and the Dewar cold finger and the heat insulation cold finger are sequentially socketed outside the cold finger of the refrigerator, so that the Dewar cold finger and the insulation The thermal and cold fingers form a two-layer heat insulation device, which finally enables the infrared detector to be equipped with a 320×256 (30 μm) very long-wave MCT chip working at a temperature of 20K. The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only ...

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Abstract

The invention discloses an infrared detector low-heat-leakage packaging device, a preparation method thereof and an infrared detector. According to the invention, a Dewar cold shield is arranged on a cold head component of a Dewar cold finger, a cold shield heat shield is arranged outside the Dewar cold shield and the cold head component, and the Dewar cold finger and a heat insulation cold finger are sequentially sleeved outside a refrigerator cold finger. A two-layer heat insulation device is formed by the Dewar cold finger and the heat insulation cold finger, so the infrared detector can carry a 320 * 256 (30 [mu]m) very long wave MCT chip working at the temperature of 20K.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a low-temperature infrared detector low-leak heat packaging device, a preparation method thereof, and an infrared detector. Background technique [0002] Cooled infrared focal plane detector is the core component of infrared imaging technology. At present, it has been widely used in civil security systems, climate and meteorological information collection, astronomical research, fire warning, production line safety production monitoring and other civilian fields, and has become an advanced photoelectric detection system. important part of the system. Cooling is a necessary working condition for high-performance infrared photon detectors. Low operating temperature can suppress the background noise of the detector, improve the signal-to-noise ratio and sensitivity of the detector, and greatly improve the detection performance of the detector. At present, infrared focal plane det...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/101H01L31/0203H01L31/024H01L31/18
CPCH01L31/101H01L31/0203H01L31/024H01L31/18Y02P70/50
Inventor 方志浩付志凯喻松林张智超王冠于小兵
Owner 11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP