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Laser machining method and device capable of changing line width

A laser processing method and laser processing technology, which are applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of low processing efficiency, achieve the effect of saving laser processing time and improving laser processing quality

Pending Publication Date: 2021-08-20
苏州科韵激光科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the prior art, the commonly used laser for semiconductors is a Gaussian spot. After focusing, the spot is small, and the laser processing line width under this spot is small. When processing a large line width, it usually needs to be processed repeatedly under this spot. resulting in lower processing efficiency

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  • Laser machining method and device capable of changing line width
  • Laser machining method and device capable of changing line width
  • Laser machining method and device capable of changing line width

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Embodiment Construction

[0054] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0055] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...

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Abstract

The invention relates to a laser machining method and device capable of changing the line width. The laser machining method comprises the steps of converting a Gaussian light spot into a flat-topped light spot through a shaping module; and adjusting an included angle between the flat-topped light spot and a preset moving direction of a to-be-processed product through a control module so as to adjust the laser machining line width to adapt to different machining widths. By means of the laser machining method and device capable of changing the line width, the included angle between the flat-topped light spot and the preset moving direction can be adjusted for the different line widths, repeated laser machining is not needed, and the laser machining time is saved.

Description

technical field [0001] The invention relates to the field of laser processing, in particular to a laser processing method and device with variable line width. Background technique [0002] At present, laser processing usually refers to the use of the thermal effect generated by the laser beam projected on the surface of the material to complete the processing process, including laser welding, laser engraving and cutting, surface modification, laser laser marking, laser drilling and micromachining, etc. Laser processing is non-contact processing, and the energy and moving speed of the high-energy laser beam can be adjusted, so it can achieve a variety of processing purposes with high processing accuracy, and is widely used in the production and processing of semiconductor components. [0003] In the prior art, the commonly used laser for semiconductors is a Gaussian spot. After focusing, the spot is small, and the laser processing line width under this spot is small. When pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00B23K26/073
CPCB23K26/00B23K26/073
Inventor 叶浩陆昱成
Owner 苏州科韵激光科技有限公司
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