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Single-phase immersed liquid cooling system

A liquid-cooled, single-phase technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve problems such as unsatisfactory cooling demand, cooling capacity limit, etc., to reduce maintenance or replacement time , reduce the impact and avoid the effect of air accumulation

Active Publication Date: 2021-08-24
ALIBABA GRP HLDG LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, with the steady increase of power density, the cooling capacity of the air-conditioning air-cooling method is also approaching the limit, which cannot meet the cooling demand. Therefore, it is necessary to provide a new cooling method to cool electronic devices

Method used

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  • Single-phase immersed liquid cooling system
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  • Single-phase immersed liquid cooling system

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Embodiment Construction

[0024] In order to better understand the above technical solutions, the technical solutions of the embodiments of this specification will be described in detail below through the drawings and specific examples. It should be understood that the embodiments of this specification and the specific features in the embodiments are detailed descriptions of the technical solutions of the embodiments of this specification. It is an explanation, not a limitation to the technical solutions of this specification. In the case of no conflict, the embodiments in this specification and the technical features in the embodiments can be combined with each other.

[0025] The embodiment of this specification provides a single-phase immersion liquid cooling system.

[0026] Such as figure 1 As shown, the single-phase immersion liquid cooling system 100 includes a cabinet 10 and a liquid cooling device. An electronic device 11 is arranged in the cabinet 10. In this embodiment, the electronic devi...

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Abstract

The embodiment of the invention provides a single-phase immersion liquid cooling system, and the system comprises a cabinet and a liquid cooling device; the liquid cooling device comprises a driving heat exchange device, a liquid inlet pipe and a liquid outlet pipe, and the driving heat exchange device comprises a liquid driver and a heat exchanger; an electronic device and cooling liquid for cooling the electronic device are arranged in the cabinet, and a liquid inlet pipe fixing hole and a liquid outlet pipe fixing hole are formed in the side wall of the cabinet; a liquid inlet valve is arranged on the liquid inlet pipe, and one end of the liquid inlet pipe penetrates through the liquid inlet pipe fixing hole to be communicated with the interior of the cabinet; a liquid outlet valve is arranged on the liquid outlet pipe, and one end of the liquid outlet pipe penetrates through the liquid outlet pipe fixing hole to be communicated with the interior of the cabinet; the other end of the liquid outlet pipe and the other end of the liquid inlet pipe communicate with the two ends of the driving heat exchange device correspondingly. The position of at least one of the liquid inlet valve and the liquid outlet valve is higher than the working liquid level of cooling liquid in the cabinet.

Description

technical field [0001] The embodiments of this specification relate to the technical field of heat dissipation of electronic equipment, and in particular to a single-phase immersion liquid cooling system. Background technique [0002] With the rapid development of cloud computing, the requirements for computing performance are getting higher and higher. While the performance of the server is improving, the power consumption is rising rapidly, and the power consumption of the cabinet has increased exponentially. The data shows that the power density of the data center cabinet has increased by 15 times in the past ten years. In the past, the power consumption of a rack was generally 1.5-2kW, but now it is as high as 20-30kW in some cases. [0003] Existing servers and data centers are air-cooled by air conditioners, and the electronic devices are cooled by the cold air sent by the air conditioners. However, with the steady increase of power density, the cooling capacity of t...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20763Y02D10/00
Inventor 刘向东
Owner ALIBABA GRP HLDG LTD
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