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Semiconductor laser tube socket rapid recycling device and recycling method

A recycling device and laser technology, applied in chemical instruments and methods, electronic waste recycling, recycling technology and other directions, can solve the problems of easy blade damage to the tube tongue, the quality of the tube seat is reduced, and the operator is uncomfortable, so as to avoid mechanical damage, The effect of improving the pass rate and increasing the safety performance

Active Publication Date: 2021-08-27
潍坊华光光电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is simple to recover the tube base, but the efficiency of pure manual operation is low. The operator can only recover the tube base alone. At the same time, the blade is easy to damage the coating on the tube tongue during the recovery process, resulting in a decline in the quality of the recovered tube base.
When this method recovers the tube base, the temperature of the heating table is too high, and the high temperature will cause great discomfort to the operator. At the same time, if the heating table is accidentally touched, it is easy to cause burns

Method used

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  • Semiconductor laser tube socket rapid recycling device and recycling method
  • Semiconductor laser tube socket rapid recycling device and recycling method
  • Semiconductor laser tube socket rapid recycling device and recycling method

Examples

Experimental program
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Effect test

Embodiment 1

[0039] Embodiment 1: as figure 1 As shown, a semiconductor laser tube holder rapid recovery device includes a main body 1 and a tube holder 31, a substrate 7 is arranged on the upper end of the main body 1, a heating platform 9 is arranged on the upper end of the substrate 7, a fixing fixture 8 is arranged on the upper end of the heating platform 9, and the tube holder 31 is located in the fixing fixture 8, and the upper end of the fixing fixture 8 is provided with a suction box 11, and the suction box 11 is used to suck the COS39 chip on the tube base 31.

[0040] Such as Figure 6 and Figure 7 , the fixing fixture 8 is located at the upper end of the heating table 9, the fixing fixture 8 includes an upper cover 30 and a lower plate 29, the middle of the upper cover 30 is provided with uniformly arranged pressure holes 33, the lower plate 29 is located at the lower end of the fixing fixture 8, and one side of the lower plate 29 A handle 35 is provided, and evenly arranged ...

Embodiment 2

[0046] Embodiment 2: Utilize the method for the semiconductor laser rapid recovery device that embodiment 1 provides to carry out socket recovery, the steps are as follows:

[0047] (1) Put the tube base 31 to be recovered in the positioning groove 36 of the lower plate 29, the pin 42 of the tube base 31 is compatible with the pin hole 38 in the positioning groove 36, the groove 41 of the tube base 31 and the positioning The fixing protrusion 37 in the groove 36 is compatible;

[0048] (2) Put the upper cover 30 on the upper end of the lower plate 29, and the pressure hole 33 of the upper cover 30 fits on the pipe seat 31 to complete the assembly of the fixing fixture 8;

[0049](3) Push the fixing fixture 8 into the fixing groove 26 of the heating platform 9 through the handle 35, the rib 25 of the heating platform 9 limits the fixing groove to avoid loosening, the heating rod 23 nested in the heating platform 9 works, and the fixing fixture 8 heating to melt the glue on the...

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Abstract

The invention relates to a semiconductor laser tube socket rapid recycling device. The semiconductor laser tube socket rapid recycling device is characterized in that by comprising a main body and a tube socket, a base plate is arranged at the upper end of the main body, a heating table is arranged at the upper end of the base plate, a fixing clamp is arranged at the upper end of the heating table, the tube socket is located in the fixing clamp, a suction box is arranged at the upper end of the fixing clamp, and the suction box is used for sucking COS chips on the tube socket. According to the semiconductor laser tube socket rapid recycling device, manual operation is replaced with the mode that automatic machinery is adopted for recycling the tube sockets, recycling work of dozens of laser tube sockets can be completed at the same time at a time, and compared with manual single operation, the efficiency is improved by dozens of times; and the tube socket is recycled in a vacuum suction COS mode, equipment does not make direct contact with a tube tongue in the tube socket recycling process, the phenomenon that a tube tongue coating is damaged when the tube socket is manually recycled is effectively avoided, and the yield of tube socket recycling is greatly increased.

Description

technical field [0001] The invention relates to the technical field of semiconductor laser packaging, in particular to a fast recovery device and recovery method for a semiconductor laser socket. Background technique [0002] After decades of development, semiconductor lasers have become more and more well-known to the society and have been applied in many fields. The photoelectric conversion efficiency of semiconductor lasers is above 60%, which is much higher than that of other similar products. The advantages of low energy consumption, less heat accumulation in the device, long life, good collimation, and long lighting distance are more and more widely used as an emerging technology in similar industries in society. The various advantages of semiconductor lasers determine that they are more and more widely valued by all walks of life. It has been widely used in the fields of communication, medical treatment, display, industrial production and security, and its applicatio...

Claims

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Application Information

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IPC IPC(8): B09B3/00
CPCB09B3/10B09B3/40Y02W30/82
Inventor 张广明刘琦周莉
Owner 潍坊华光光电子有限公司