Braid packaging system for DFN miniature device

A micro-device and packaging system technology, applied in packaging, transportation packaging, transportation and packaging, etc., can solve problems such as deflection, poor packaging, and easily damaged DFN micro-device, etc., to achieve the effect of ensuring quality and ensuring yield

Active Publication Date: 2021-08-31
东莞市华越半导体技术股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the packaging process, it is necessary to transport the DFN micro-devices to the loading station, and then transport the DFN micro-devices to the braid through the suction cup; the disadvantage is that when the conveying device transports the DFN micro-devices to the loading station, the DFN micro-devices The orientation is prone to deflection, and it is difficult to adjust the DFN micro-device to the preset position and angle only through the suction cup, which causes the position and

Method used

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  • Braid packaging system for DFN miniature device
  • Braid packaging system for DFN miniature device
  • Braid packaging system for DFN miniature device

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Embodiment Construction

[0046] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0047] In the description of the present invention, it should be understood that the orientations or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner" and "outer" are based on those shown in the accompanying drawings. Orientation or positional relationship is only for the convenience of describing th...

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PUM

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Abstract

The invention discloses a braid packaging system for a DFN miniature device. The braid packaging system is characterized by comprising a frame body and a carrier tape track assembly arranged on the frame body, wherein a carrier tape discharging mechanism, a carrier tape driving mechanism, a feeding conveying mechanism, a cover tape discharging mechanism, a hot-pressing packaging mechanism and a discharging mechanism are sequentially arranged on the frame body in the carrier tape conveying direction of the carrier tape track assembly; the feeding conveying mechanism comprises a conveying platform, and the conveying platform comprises a first platform and a second platform rotationally connected to the first platform; and the top surface of the second platform is provided with an accommodating groove and a detection mechanism, the accommodating groove is used for accommodating the DFN miniature device, and the detection mechanism is used for detecting the orientation of the DFN miniature device in the accommodating groove. The device can detect the orientation of the DFN miniature device and adjust the angle of the DFN miniature device according to the orientation, so that the DFN miniature device is aligned with a material carrying position on a carrier tape, the orientation unification of the DFN miniature device during packaging is ensured, and the packaging quality is ensured.

Description

technical field [0001] The invention relates to the technical field of packaging of electronic equipment, in particular to a tape packaging system for DFN micro devices. Background technique [0002] With the development of electronic products, consumer electronic products such as notebook computers, mobile phones, mini-CDs, palmtop computers, CPUs, and digital cameras are becoming more and more miniaturized. Among them, chips such as DFN micro-devices as the core play a key role. Among them, DFN micro-devices include a packaging process in the finished product process, and the function of the packaging process is to package the DFN micro-devices. [0003] In the prior art, the DFN micro-device uses a braid as a substrate, and a sealing film is covered on the braid carrying the DFN micro-device to complete the packaging. In the packaging process, it is necessary to transport the DFN micro-devices to the loading station, and then transport the DFN micro-devices to the braid ...

Claims

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Application Information

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IPC IPC(8): B65B15/04B65B51/10
CPCB65B15/04B65B51/10
Inventor 曹皇东曹国光丘仕棋李浪涛
Owner 东莞市华越半导体技术股份有限公司
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