A dfn micro device taping packaging system

Abstract

A DFN micro-device braided packaging system is characterized in that it includes a frame body and a carrier tape track assembly installed on the frame body; the frame body is sequentially provided with a carrier tape discharge mechanism along the carrier tape conveying direction of the carrier tape track assembly. , carrier belt drive mechanism, feeding and conveying mechanism, cover tape discharging mechanism, hot-pressing packaging mechanism and unloading mechanism; the feeding and conveying mechanism includes a conveying platform, and the conveying platform includes a first platform and a first platform rotatably connected to the first platform. Two platforms; the top surface of the second platform is provided with an accommodating groove and a detection mechanism, the accommodating groove is used for accommodating DFN micro-devices, and the detection mechanism is used for detecting the orientation of the DFN micro-devices in the accommodating groove. The device can detect the orientation of the DFN micro device, and adjust the angle of the DFN micro device according to the orientation, so that it is aligned with the loading position on the carrier tape, which ensures the uniform orientation of the DFN micro device during packaging and ensures the quality of the packaging.

Description

technical field [0001] The present invention relates to the technical field of electronic equipment packaging, in particular to a tape packaging system for DFN micro-devices. Background technique [0002] With the development of electronic products, consumer electronic products such as notebook computers, mobile phones, mini CDs, PDAs, CPUs, and digital cameras are becoming more and more miniaturized. Among them, the core DFN micro device and other chips play a key role. Among them, the DFN micro device includes a packaging process in the finished product process, and the function of the packaging process is to package the DFN micro device. [0003] In the prior art, the DFN micro-device is based on a tape as a substrate, and a layer of sealing film is covered on the tape carrying the DFN micro-device to complete the packaging. In the packaging process, the DFN micro-devices need to be transported to the feeding station, and then the DFN micro-devices are transported to the...

AI Technical Summary

Problems solved by technology

In the packaging process, it is necessary to transport the DFN micro-devices to the loading station, and then transport the DFN micro-devices to the braid through the suction cup; the disadvantage is that when the conveying device transports the DFN micro-devices to the loading station, the DFN micro-devices The orientation is prone to deflection, and it is difficult to adjust the DFN micro-device to the preset position and angle only through the suction cup, which causes the position and angle of the DFN micro-device to be inconsistent during packaging, which easily leads to poor packaging

Since DFN is a miniature precision device, it is very easy to damage the DFN micro-device by directly moving the position of the DFN micro-device through the manipulator.

[0004] In view of this, it is necessary to provide a packaging equipment for DFN micro devices to solve the technical problem of poor packaging caused by the azimuth deflection of DFN micro devices in the packaging process

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