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Anti-adhesion plate and preparation method thereof and evaporation equipment

A technology for preventing plates and substrates, applied in the field of vapor deposition, can solve the problems of material waste and increase of production costs, etc.

Active Publication Date: 2021-09-10
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the above problems, the present application provides an anti-sticking plate and its preparation method, and evaporation equipment, which solves the problem of material waste and increased production cost caused by most of the evaporation materials attached to the inside of the evaporation chamber in the prior art. technical problem

Method used

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  • Anti-adhesion plate and preparation method thereof and evaporation equipment
  • Anti-adhesion plate and preparation method thereof and evaporation equipment
  • Anti-adhesion plate and preparation method thereof and evaporation equipment

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Embodiment Construction

[0053] The implementation of the application will be described in detail below in conjunction with the accompanying drawings and examples, so that the implementation process of how to apply technical means to solve technical problems and achieve corresponding technical effects in this application can be fully understood and implemented accordingly. The embodiments of the present application and the various features in the embodiments can be combined with each other under the premise of not conflicting, and the formed technical solutions are all within the protection scope of the present application. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Like reference numerals refer to like elements throughout.

[0054]It should be understood that although the terms "first", "second", "third" etc. may be used to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or ...

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Abstract

The invention provides an anti-adhesion plate and a preparation method thereof and evaporation equipment. The anti-adhesion plate comprises a base plate and a hydrophobic and oleophobic coating covering the upper surface of the base plate, wherein the base plate comprises a substrate and a plurality of bosses arranged above the substrate at intervals, and wherein the arrangement density of the plurality of bosses above the substrate is gradually increased in a preset direction, the size of the bosses and the distance between any two adjacent bosses are micron-sized, and the thickness of the hydrophobic and oleophobic coating is smaller than that of the bosses. According to the anti-adhesion plate and the preparation method thereof and the evaporation equipment, the surface energy gradient is formed through the change of the arrangement density of the bosses and the covering of the hydrophobic and oleophobic coating, so that a molten evaporation material can flow from a high-surface-energy area (with small arrangement density of the bosses) to a low-surface-energy area (with large arrangement density of the bosses), directional flowing is achieved, the evaporation material is convenient to collect and recover, and the production cost is reduced.

Description

technical field [0001] The present application relates to the field of vapor deposition technology, in particular to an anti-sticking plate, a preparation method thereof, and vapor deposition equipment. Background technique [0002] Organic Light Emitting Diode (OLED), as a new type of pure solid-state display technology, has the previous technical advantages, and has attracted widespread attention for its unique advantages such as self-illumination, ultra-thin, fast response, and wide viewing angle. Technology has been extensively researched and produced. The preparation of the organic light-emitting layer in the OLED display usually adopts vacuum evaporation technology. In the evaporation chamber, the evaporation material in the crucible is heated to evaporate and deposit on the target panel. However, during the process, the evaporated Only a small amount (about 2%) of the evaporation material is deposited on the target panel, and the remaining about 98% of the evaporatio...

Claims

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Application Information

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IPC IPC(8): C23C14/50C23C14/24C23C14/04
CPCC23C14/50C23C14/24C23C14/042
Inventor 魏振业曾诚陈立张宏伟
Owner BOE TECH GRP CO LTD
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