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Manufacturing method for preventing hole copper stripping of a PCB and PCB

A technology of a PCB board and a manufacturing method, which is applied to the formation of electrical connection of printed components, electrical connection of printed components, printed circuit components, etc., can solve problems such as separation of holes and walls

Pending Publication Date: 2021-09-10
KUNSHAN DAYANG PRINTED CIRCUIT BOARD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, thick copper products with large holes have higher requirements for the combination of hole copper and hole wall. In traditional methods, hole wall (hole copper) separation often occurs after high temperature after HASL

Method used

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  • Manufacturing method for preventing hole copper stripping of a PCB and PCB
  • Manufacturing method for preventing hole copper stripping of a PCB and PCB
  • Manufacturing method for preventing hole copper stripping of a PCB and PCB

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Embodiment Construction

[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

[0032] see Figure 1-3 , the invention provides a kind of technical scheme: a kind of manufacture method that prevents PCB board hole copper from peeling off, comprises the following steps:

[0033] S1: Manually inspect PCB boards, select qualified PCB boards, and clean and dry them;

[0034] S2: Grind the drilling needle to meet the design requirements, and then install the drilling needle on the drilling equipment;

[0035] S3: Drill the PCB board so that the roug...

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Abstract

The invention discloses a manufacturing method for preventing hole copper stripping of a PCB. The method comprises the following steps that: the PCB is manually detected, a qualified PCB is selected, and then cleaned and dried; a drilling point is ground to meet the design requirement, and then the drilling point is installed on drilling equipment; drilling is carried out on the PCB, so that the roughness of the hole wall is controlled within 25 microns; the inner layer of the hole is provided with at least one first connecting copper foil, and the two ends of the hole are respectively provided with a second connecting copper foil; and the PCB is electroplated to form a layer of hole copper on the hole wall, and the hole copper is connected with the first copper foil and the second copper foil respectively. The invention also discloses the PCB. The first hole ring is arranged on the inner layer of the hole, the internal binding force of the hole wall and the hole copper can be improved, and therefore the problem that the hole wall is separated from the hole copper after high-temperature tin spraying can be solved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a manufacturing method and a PCB for preventing copper stripping in PCB holes. Background technique [0002] According to the number of layers of circuit boards, printed circuit boards can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards. Multilayer circuit boards have wiring on multiple sides, but to use wires on both sides, there must be proper circuit connections between the two sides. This "bridge" between circuits is called a via. The guide hole is a small hole filled or coated with metal on the PCB, which can be connected to the wires on both sides. [0003] With the upgrading of customers' products, the classification of PCB circuit board application scenarios has expanded, and some products that can adapt to high-power, high-temperature, and high-humidity environme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42H05K1/11
CPCH05K3/42H05K1/115
Inventor 计向东
Owner KUNSHAN DAYANG PRINTED CIRCUIT BOARD
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