800G optical module with efficient heat dissipation

Abstract

The invention provides an 800G optical module capable of efficiently dissipating heat, which is good in heat dissipation effect on a transmitting end and a receiving end. The optical module comprises an upper shell, a lower shell and a PCB (Printed Circuit Board), wherein the upper shell and the lower shell can be spliced into a whole, the PCB is arranged between the upper shell and the lower shell, and a control chip, a transmitting end assembly and a receiving end assembly are arranged on the PCB. The antenna is characterized in that a transmitting end assembly is arranged on a first surface of the PCB, the control chip and the receiving end assembly are respectively arranged on a second surface of the PCB, the antenna further comprises a metal heat sink, an upper surface of the metal heat sink is respectively close to the receiving end assembly and the transmitting end assembly, and the lower surface of the metal heat sink is close to the lower shell.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to an 800G optical module with high heat dissipation. Background technique [0002] With the continuous and rapid development of my country's optical communication industry and the renewal and upgrading of communication technology, optical modules, as the basis for building modern high-speed information networks, play a vital role in the optical communication industry, and their continuous development is an inevitable trend. [0003] At present, the supporting circuits of 800G optical modules are complicated, there are many types and quantities of electronic components, the wiring density is high, the layout space is limited, and the design is difficult. Compared with traditional photonic technology, if silicon photonics technology is applied to 800G optical modules, it will be more It can meet the urgent needs of the optical module industry for lower cost, higher inte...

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Problems solved by technology

[0003] At present, the supporting circuits of 800G optical modules are complicated, there are many types and quantities of electronic components, the wiring density is high, the layout space is limited, and the design is difficult. Compared with traditional photonic technology, if silicon photonics technology is applied to 800G optical modules, it will be more It can meet the urgent needs of the optical module industry for lower cost, higher integration, higher speed, lower power consumption and reliability, and is the key technology to solve the current bottleneck problems in power consumption, speed, layout space and other aspects

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