Embedded micro-channel heat dissipation device based on liquid metal
A heat dissipation device and liquid metal technology, applied in semiconductor/solid-state device parts, electrical components, electric solid-state devices, etc., can solve problems such as chips not working properly, chips with high power and heat generation, and heat-dissipating devices with poor heat dissipation effects, etc., to achieve Improve heat dissipation efficiency, reduce thermal resistance, and prevent evaporation
Pending Publication Date: 2021-09-24
NORTHWESTERN POLYTECHNICAL UNIV
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Problems solved by technology
[0007] The purpose of the present invention is to solve the technical problem that the current chip has high power and serious heat generation, and the heat dissipation effect of the cooling device is not good, which leads to the chip not working normally, and provides an embedded micro-channel cooling device based on liquid metal
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[0029] Below in conjunction with accompanying drawing and specific embodiment content of the present invention is described in further detail:
[0030] Such as figure 1 , 2 , 3, a high-power chip is divided into two layers from top to bottom, which are circuit structure 1-2 and substrate 1-1 (silicon substrate), and the high-power chip realizes the correspondingly designed electrical function after being powered on , but also generate a lot of heat.
[0031] The substrate is used as the base of the embedded microchannel cooling device, and a cooling channel is arranged in the base; the cooling channel includes a fluid inlet 2-1, a fluid outlet 2-2, 5 inlet microchannels 3-1 and 5 outlet microchannels 3-2 .
[0032] The fluid inlet and the fluid outlet are arranged in parallel; 5 inlet microchannels are vertically connected with the fluid inlet successively along the length direction of the fluid inlet, 5 outlet microchannels are vertically connected with the fluid outlet su...
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The invention provides an embedded micro-channel heat dissipation device based on liquid metal, and solves the technical problems that a chip cannot work normally due to the fact that a current chip is high in power and serious in heating and a heat dissipation device is poor in heat dissipation effect. The embedded micro-channel heat dissipation device based on liquid metal takes a chip substrate as a base, and a heat dissipation channel is arranged in the base; the heat dissipation channel comprises a fluid inlet, a fluid outlet, N inlet micro-channels and N outlet micro-channels, and N is an integer greater than 2; the N inlet micro-channels and the N outlet micro-channels are sequentially arranged in parallel at intervals, and the adjacent inlet micro-channels and outlet micro-channels are communicated through a plurality of parallel branch micro-channels; and liquid metal serves as cooling liquid, flows into the inlet microchannels through the fluid inlet, then flows into the outlet microchannels through the branch microchannels and finally flows out through the fluid outlet, the heat dissipation purpose is achieved, and the liquid metal is pumped in through the micropump.
Description
technical field [0001] The invention relates to the technical field of microelectronic heat dissipation, in particular to an embedded microchannel heat dissipation device based on liquid metal. Background technique [0002] With the development of science and technology, the size of integrated circuits has been reduced from the initial micron level to less than 10 nanometers today. The smaller size has brought higher integration, and the number of transistors on a single chip has reached tens of billions. Although the smaller size reduces the power consumption of individual transistors, it cannot eliminate the increase in total power brought about by the rapid increase in the number of transistors. Therefore, the power consumption of current chips is generally high, and the problem of heat generation is becoming more and more serious. [0003] Studies have shown that for every 10°C increase in chip temperature, the MOS current drive capability will decrease by about 4%, an...
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IPC IPC(8): H01L23/367H01L23/42H01L23/473
CPCH01L23/367H01L23/42H01L23/473
Inventor 王少熙张哲欣
Owner NORTHWESTERN POLYTECHNICAL UNIV