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High-activity lead-free solder paste and preparation method thereof

A lead-free solder paste, high activity technology, used in manufacturing tools, welding equipment, metal processing equipment and other directions, can solve the problems of easy to cause pillow effect, weak activity of solder paste, etc., to achieve the effect of mild reaction and simple process

Active Publication Date: 2021-09-28
中山翰华锡业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention is a highly active lead-free solder paste to solve the problem of weak solder paste activity and easy to cause pillow effect in the prior art. The solder paste of the present invention passes through Optimize the composition of tin powder and flux so that it has high activity and good wettability, so that the solder paste can still maintain good soldering activity under continuous high-temperature baking, and inhibit the formation of oxide film on the solder surface during reflow soldering heating , to ensure good contact between solder and solder paste, to prevent the pillow effect

Method used

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  • High-activity lead-free solder paste and preparation method thereof
  • High-activity lead-free solder paste and preparation method thereof
  • High-activity lead-free solder paste and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0033]A highly active lead-free solder paste, comprising the following weight components, 85.12% tin flour, 11.92%, dispersant 2.96%, wherein the tin powder is dispensing, such as Table 2, the fluxed As described in Table 3, the dispersing agent is an oleic acid amide; the preparation method, including the following steps:

[0034] According to Table 2, the weight percentage of Table 3 refers to each component, backup; first add the solvent to the container, heated to 110 ° C, then add rosin, stir until the rosin is completely dissolved, maintain the temperature at 110 ° C, will touch The variable agent is added to the container, maintains the temperature and stir until completely dissolve; the temperature drops to 60 ° C, the active agent, the antioxidant, the temperature is maintained and stirred for 30 minutes; the mixture is ground to grasses at 4000 r / min. The diameter is less than 20 microns to obtain a flux; 11.92% of the fluxing and 85.12% tin powder and 2.96% dispersant...

Embodiment 2

[0036] A highly active lead-free tin cream comprising the following weight components, 84.8% tin flour, 13.8%, dispersing agent 1.4%, wherein the tin powder is dispensed, such as Table 2, the fluxed Group 3, for example, the dispersant is a mixture of ethyl bisteanamide and polyacryl dimethylsulfonate 1: 1 mixed; the preparation method, including the following steps:

[0037] According to Table 2, the weight percentage of Table 3 refers to the components, spare; add the solvent to the container, heated to 130 ° C, then add rosin, stir into the rosin completely dissolved, keep the temperature at 130 ° C, will thicken The agent is added to the container, maintains the temperature and stir it until it completely dissolves; the temperature drops to 50 ° C, the active agent, the antioxidant, the temperature is maintained and stirred for 25 minutes; the mixture was ground to the particle diameter of 5000 r / min. The flux is obtained; a 13.8% fluxing and 84.8% tin powder and 1.4% disper...

Embodiment 3

[0039] A highly active lead-free tin cream comprising the following weight components, 86.11% tin flour, 10.09%, dispersing agent 3.8%, wherein the tin powder is dispensed, such as Table 2, the fluxed As described in Table 3, the dispersing agent is a dual stearid amide; the preparation method includes the following steps:

[0040] According to Table 2, the weight percentage of Table 3 refers to each component, backup; add the solvent to the container, heated to 120 ° C, then add rosin, stir well completely dissolved, keep the temperature at 120 ° C, will throw The agent is added to the container, the temperature is maintained and stirred until completely dissolve; the temperature drops to 80 ° C, the active agent, the antioxidant, the temperature is maintained and stirred for 20 minutes; the mixture is grounded at 3000 r / min to ground the particle diameter at a rotational speed of 3000 r / min. 20 microns to obtain flux; 10.09% flux and 86.11% tin powder and 3.8% dispersant wer...

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Abstract

The invention discloses high-activity lead-free solder paste and a preparation method thereof. According to the technical scheme, the high-activity lead-free solder paste is prepared from the following components of, in percentage by weight, 84.8%-90.6% of tin powder, 8.2%-13.8% of scaling powder and 1.2%-3.8% of dispersing agent, the tin powder is composed of 2.8%-4.5% of Ag, 1.5%-2.1% of Cu, 0.5%-1.2% of Bi, 0.1%-0.5% of Sb and the balance Sn, and the scaling powder is composed of 36.4%-47.3% of rosin, 19.9%-30.6% of solvent, 6.2%-15.1% of thixotropic agent, 14.3%-22.5% of active agent and 1.2%-5.6% of antioxidant. By optimizing the components of the tin powder and the soldering flux, the solder paste has high activity and good wettability, the solder paste still keeps good welding activity under continuous high-temperature baking, generation of an oxidation film on the surface of a solder during reflow soldering heating is inhibited, good contact between the solder and the solder paste is guaranteed, and the head-in-pillow effect is prevented.

Description

[0001] According to the application, the application number of the original application is 2019102105693, the application date is March 20, 2019, and the present invention is: a lead-free tin paste and its preparation method. Technical field [0002] The present invention belongs to the technical field of welding material, and more particularly to a highly active lead-free solder paste and a preparation method thereof. Background technique [0003] Solder is a homogeneous solder powder and a stable flux to uniformly mix in a certain proportion, which can make the lead or endpoint of the surface assembly to form alloys with the PCB printed plate when welding. Sexual connection. However, when assembling BGA or CAP on a PCB printing board, the resulting pillow effect (HIP) makes the electronic manufacturing industry very much. [0004] The pillow effect is used to describe the BGA parts of the board in the high temperature of the reflow. The BGA solder ball and solder paste are not f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/02B23K35/26B23K35/36B23K35/40
CPCB23K35/025B23K35/262B23K35/3612B23K35/40
Inventor 李爱良杨玉红童桂辉付波汪亮冷学魁
Owner 中山翰华锡业有限公司
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