Superheated pipeline metallographic analysis method realized by using ultrasound under low load condition
A metallographic analysis, low-load technology, used in the analysis of solids using sonic/ultrasonic/infrasonic waves, material analysis using sonic/ultrasonic/infrasonic waves, and material analysis. It can solve problems such as inconvenient monitoring and achieve high environmental applicability. Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
specific Embodiment approach 1
[0017] Specific implementation mode 1: The method for metallographic analysis of superheated pipelines realized by ultrasound under low-load conditions in this implementation mode is specifically carried out according to the following steps:
[0018] 1. Clean the surface of the superheated pipeline to be tested, apply coupling agent, and then set the ultrasonic receiving probe and ultrasonic transmitting probe symmetrically at both ends of the diameter of the superheated pipeline to ensure that both the ultrasonic receiving probe and the ultrasonic transmitting probe are in contact with the coupling agent contact;
[0019] Two, the ultrasonic transmitting probe emits an ultrasonic pulse, which is received by the ultrasonic receiving probe; measure the acoustic time value T between the ultrasonic transmitting pulse and the receiving pulse and the sound path L between the ultrasonic transmitting pulse and the receiving pulse, by the formula V=L / T finds the ultrasonic sound velo...
specific Embodiment approach 2
[0025] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the coupling agent in step 1 is carbomer resin. Others are the same as in the first embodiment.
specific Embodiment approach 3
[0026] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the thickness of the coupling agent in step 1 is 0.05-0.2 mm. Others are the same as in the first or second embodiment.
PUM
| Property | Measurement | Unit |
|---|---|---|
| Thickness | aaaaa | aaaaa |
| Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com



