A method for detecting wafer center offset
An offset detection and wafer technology, applied in image analysis, image enhancement, instruments, etc., can solve problems such as wafer center offset, achieve smooth noise, improve measurement accuracy, and reduce calculation difficulty
Active Publication Date: 2022-02-22
ZHAOQING ZHONGDAO OPTOELECTRONICS EQUIP CORP
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[0012] The purpose of the present invention is to solve the shortcoming of existing wafer center offset calculation method
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[0049] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.
[0050] In the present invention, when doing wafer alignment (wafer alignment), the wafer is rotated on the turntable to obtain the rules formed under the camera during rotation. Such as figure 1 As shown, the origin of the camera is on the same horizontal line as the center of the θ-axis, and the θ-axis rotates the wafer for a circle. From the camera, it can be seen that the arc edge of the wafer on this horizontal line shifts left...
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The invention provides a wafer center offset detection method, comprising: driving the wafer to rotate once on the turntable; acquiring multiple images formed under the camera during the rotation; calculating the offset angle of the wafer according to the multiple images ; Calculate the offset distance of the wafer according to the plurality of images; calculate the offset coordinates of the center of the circle according to the offset angle and the offset distance of the wafer. The invention adopts a rotating stage to drive the wafer to rotate, fixed-point photography, simple structure, free and controllable acquisition resolution; accurate derivation of the circle center offset formula, calculation of the circle center offset using a separate calculation method, and multi-measurement data for fitting to improve Measure accuracy, perform equivalent estimation on small data, and reduce calculation difficulty under the premise of data fidelity. Use the curve characteristics of the cosine trigonometric function to verify, interpolate, and compensate data, eliminate missing and abnormal data, smooth noise, and improve measurement accuracy and precision.
Description
technical field [0001] The invention belongs to the field of wafer manufacturing detection, and in particular relates to a method for detecting the deviation of the center of a wafer. Background technique [0002] With the continuous improvement of the wafer manufacturing process, the requirements for the alignment accuracy of the wafer detection in the manufacturing process are also getting higher and higher. In the wafer manufacturing process, the position of the defect cannot be accurately located due to the deviation of the center position or insufficient alignment accuracy. , loading and unloading collision, clamping failure, and other problems, so alignment or more precise adjustments are required during the transfer process, and the transfer device will be adjusted according to the calculated offset position difference to keep it in good alignment (Alignment) state or meet higher precision requirements. [0003] The existing technology generally has the following pro...
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IPC IPC(8): G06T7/66G06T7/00
CPCG06T7/66G06T7/0004G06T2207/10004G06T2207/30148
Inventor 陈盛闯张梁李波
Owner ZHAOQING ZHONGDAO OPTOELECTRONICS EQUIP CORP