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Packaging structure, packaging method, camera module and electronic equipment

A technology of encapsulation structure and wire routing, which is applied in the direction of TV, circuit, color TV, etc., can solve the problems of large size and unfavorable thin and light design of electronic equipment, so as to improve the light incident rate, avoid large frame width, reduce the The effect of small package cost

Active Publication Date: 2021-10-01
SHANGHAI AVIC OPTOELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the packaging structure of the existing CIS chip is relatively large, which is not conducive to the realization of thin and light design of electronic equipment

Method used

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  • Packaging structure, packaging method, camera module and electronic equipment
  • Packaging structure, packaging method, camera module and electronic equipment
  • Packaging structure, packaging method, camera module and electronic equipment

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Embodiment Construction

[0050] In order to better understand the technical solutions of the present invention, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0051] It should be clear that the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0052] Terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used in the embodiments of the present invention and the appended claims, the singular forms "a", "said" and "the" are also intended to include the plural forms unless the context clearly indicates otherwise.

[0053] It should be understood that the term "an...

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Abstract

The embodiment of the invention provides a packaging structure, a packaging method, a camera module and electronic equipment, relates to the technical field of packaging, and aims to effectively reduce the size of a packaging structure. The packaging structure comprises: a light-transmitting substrate; a re-wiring layer located on one side of the light-transmitting substrate, wherein the re-wiring layer comprises metal wires, and is provided with a first connecting area and a second connecting area, and the metal wires in the second connecting area are used for being electrically connected with an external signal processing device; a photosensitive chip located on the side, back on to the light-transmitting substrate, of the re-wiring layer, wherein the pins of the photosensitive chip are electrically connected with the metal wires of the first connecting area, the photosensitive chip comprises a photosensitive surface used for sensing optical signals, the photosensitive surface faces the light-transmitting substrate and comprises a photosensitive area, and in the direction perpendicular to the plane where the light-transmitting substrate is located, the metal wires are not overlapped with the photosensitive area; and a plastic packaging layer wrapping the photosensitive chip.

Description

【Technical field】 [0001] The invention relates to the field of packaging technology, in particular to a packaging structure and packaging method, a camera module, and electronic equipment. 【Background technique】 [0002] A CMOS image sensor (CMOS Image Sensor, CIS) chip is an electronic device that can sense external light and convert it into an electrical signal, and is widely used in electronic devices such as cameras. The CIS chip is usually manufactured using a semiconductor manufacturing process, and then a package structure is formed by performing a series of packaging processes on the CIS chip. However, the packaging structure of the existing CIS chip is relatively large, which is not conducive to the realization of thin and light design of electronic equipment. 【Content of invention】 [0003] In view of this, the embodiments of the present invention provide a packaging structure and packaging method, a camera module, and an electronic device, which effectively red...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/14H01L21/56H01L27/146H04N5/374H04N5/225
CPCH01L23/3121H01L23/14H01L21/563H01L27/146H04N23/57H04N23/55H04N23/54H04N25/76
Inventor 席克瑞彭旭辉秦锋崔婷婷张劼林柏全
Owner SHANGHAI AVIC OPTOELECTRONICS