Peptizing and film tearing mechanism for ceramic chip slices

A ceramic sheet and debonding technology, applied in conveyor objects, lamination auxiliary operations, lamination and other directions, can solve the problems of heavy workload, small ceramic sheet, easy fatigue, etc., to improve work efficiency, meet demand, and quickly The effect of debonding and tearing off

Pending Publication Date: 2021-10-08
苏州达文西自动化科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If manual operation is used, the ceramic pieces after cutting are relatively small, not easy to tear off, and it is easy to be tired after long-term operation, the workload is relatively large, and the efficiency is relatively low

Method used

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  • Peptizing and film tearing mechanism for ceramic chip slices
  • Peptizing and film tearing mechanism for ceramic chip slices
  • Peptizing and film tearing mechanism for ceramic chip slices

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Experimental program
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Embodiment Construction

[0029] The present invention will be described in detail in conjunction with accompanying drawing now. This figure is a simplified schematic diagram only illustrating the basic structure of the present invention in a schematic manner, so it only shows the components relevant to the present invention.

[0030] Such as figure 2 and image 3 As shown, a degumming and film tearing mechanism 4 of a ceramic sheet slice 1 of the present invention includes a degumming platform 2, and the degumming platform 2 is provided with a degumming mechanism 3, a film tearing mechanism 4, an adsorption type discharge Table 5, feeding manipulator 9 and the feed bin 7 for placing ceramic sheet 1b, described degumming mechanism 3 is used for making the adhesive film 1a on the back side of ceramic sheet 1b lose viscosity; Described film tearing mechanism 4 is used for will lose viscosity The adhesive film 1a is torn off from the ceramic sheet 1b; the adsorption type discharge table 5 is used to pl...

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PUM

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Abstract

The invention provides a peptizing and film tearing mechanism for ceramic chip slices. The peptizing and film tearing mechanism comprises a peptizing platform, wherein a peptizing mechanism, a film tearing mechanism, a feeding manipulator and a bin for placing ceramic chips are arranged on the peptizing platform; the peptizing mechanism is used for enabling adhesive films on the back surfaces of the ceramic chips to lose viscosity; the film tearing mechanism is used for tearing off the adhesive films losing viscosity from the ceramic chips; the bin is used for placing the ceramic chip slices; and the feeding manipulator is used for adsorbing the ceramic chip slices to circulate among different stations. The peptizing and film tearing mechanism can realize quick peptizing and tearing of the adhesive films, improves the working efficiency, and meets the demands of an automatic production line.

Description

technical field [0001] The invention relates to the technical field of PCB board production equipment, in particular to a degumming and film tearing mechanism for ceramic chip slices. Background technique [0002] The embedded ceramic chip in the PCB board is mainly designed to solve the problem of failure caused by the aging of the PCB itself due to heat dissipation and shortened life of the high-power heating components on the PCB during use. Therefore, it is necessary to correspond to high-power components on the PCB board. The position of the heating element is embedded in the ceramic sheet, and its position accuracy is relatively high (±0.005mm). This process is currently widely used in foreign mainstream automobile lamp factories. It is a necessary process for LED light source and laser light source PCB board. [0003] The raw material of the ceramic sheet is a whole piece. When in use, the whole piece of ceramic sheet needs to be cut according to the required size, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/91B32B38/10B65G47/74
CPCB65G47/915B65G47/917B32B38/10B65G47/74
Inventor 唐亮辛惠显
Owner 苏州达文西自动化科技有限公司
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