Automatic assembling machine for inlaid ceramic chips

Abstract

The invention provides an automatic assembling machine for inlaid ceramic chips. Theautomatic assembling machine comprises a ceramic chip peptizing and film tearing mechanism, a visual ceramic chip embedding mechanism, a substrate alternate material changing mechanism and a substrate laminating mechanism which are sequentially arranged along a working procedure, wherein the ceramic chip peptizing and film tearing mechanism is used for peptizing and tearing glue films on the back surfaces of ceramic chip slices, and feeding and supplying materials to the visual ceramic chip embedding mechanism; and the visual ceramic chip embedding mechanism is used for embedding the ceramic chip into the through hole of the PCB after the glue film of the ceramic chip is removed by the ceramic chip peptizing and film tearing mechanism, so that embedding of the ceramic chip is realized. Rapid dispergation and tearing of a glue film can be realized, the working efficiency is improved, and the requirements of an automatic production line are met; the sizes of the holes in the plate can be accurately recognized in a visual recognition mode, so that the accuracy of placing the ceramic chips is improved, manual discharging is converted into mechanical arm discharging, and the automation level and the production efficiency are improved.

Description

technical field [0001] The invention relates to the technical field of PCB board production equipment, in particular to an automatic assembly machine for inlaid ceramic sheets. Background technique [0002] The embedded ceramic chip in the PCB board is mainly designed to solve the problem of failure caused by the aging of the PCB itself due to heat dissipation and shortened life of the high-power heating components on the PCB during use. Therefore, it is necessary to correspond to high-power components on the PCB board. The position of the heating element is embedded in the ceramic sheet, and its position accuracy is relatively high (±0.005mm). This process is currently widely used in foreign mainstream automobile lamp factories. It is a necessary process for LED light source and laser light source PCB board. [0003] In the manufacturing process of the PCB board, at first, the heat dissipation requirements of the heating components on the PCB board determine the required si...

AI Technical Summary

Problems solved by technology

If manual operation is used, the ceramic pieces after cutting are relatively small, not easy to tear off, and it is easy to be tired after long-term operation, the workload is relatively large, and the efficiency is relatively low

[0006] On the other hand, there are many through-holes on the PCB, and the sizes of the through-holes on some PCBs are different. Eac

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